The Global Market for Thermal Management Materials and Systems 2025-2035

TABLE OF CONTENTS

1. INTRODUCTION

• 1.1. Thermal management
  • 1.1.1. Active
  • 1.1.2. Passive
• 1.2. Thermal Management Systems
  • 1.2.1. Immersion Cooling Systems for Data Centers
  • 1.2.2. Battery Thermal Management for Electric Vehicles
  • 1.2.3. Heat Exchangers for Aerospace Cooling
  • 1.2.4. Air Cooling Systems
  • 1.2.5. Liquid Cooling Systems
  • 1.2.6. Vapor Compression Systems
  • 1.2.7. Spray Cooling Systems
  • 1.2.8. Hybrid Cooling Systems
    • 1.2.8.1. Hybrid Liquid-to-Air Cooling
    • 1.2.8.2. Hybrid Liquid-to-Liquid Cooling
    • 1.2.8.3. Hybrid Liquid-to-Refrigerant Cooling
    • 1.2.8.4. Hybrid Refrigerant-to-Refrigerant Cooling
• 1.3. Main types of thermal management materials and technologies

2. THERMAL INTERFACE MATERIALS

• 2.1. What are thermal interface materials (TIMs)?
  • 2.1.1. Types
  • 2.1.2. Thermal conductivity
• 2.2. Comparative properties of TIMs
• 2.3. Advantages and disadvantages of TIMs, by type
• 2.4. Prices
• 2.5. Thermal greases and pastes
• 2.6. Thermal gap pads
• 2.7. Thermal gap fillers
• 2.8. Thermal adhesives and potting compounds
• 2.9. Metal-based TIMs
  • 2.9.1. Solders and low melting temperature alloy TIMs
  • 2.9.2. Liquid metals
  • 2.9.3. Solid liquid hybrid (SLH) metals
    • 2.9.3.1. Hybrid liquid metal pastes
    • 2.9.3.2. SLH created during chip assembly (m2TIMs)
• 2.10. Carbon-based TIMs
  • 2.10.1. Multi-walled nanotubes (MWCNT)
    • 2.10.1.1. Properties
    • 2.10.1.2. Application as thermal interface materials
  • 2.10.2. Single-walled carbon nanotubes (SWCNTs)
    • 2.10.2.1. Properties
    • 2.10.2.2. Application as thermal interface materials
  • 2.10.3. Vertically aligned CNTs (VACNTs)
    • 2.10.3.1. Properties
    • 2.10.3.2. Applications
    • 2.10.3.3. Application as thermal interface materials
  • 2.10.4. BN nanotubes (BNNT) and nanosheets (BNNS)
    • 2.10.4.1. Properties
    • 2.10.4.2. Application as thermal interface materials
  • 2.10.5. Graphene
    • 2.10.5.1. Properties
    • 2.10.5.2. Application as thermal interface materials
      • 2.10.5.2.1. Graphene fillers
      • 2.10.5.2.2. Graphene foam
      • 2.10.5.2.3. Graphene aerogel
  • 2.10.6. Nanodiamonds
    • 2.10.6.1. Properties
    • 2.10.6.2. Application as thermal interface materials
  • 2.10.7. Graphite
    • 2.10.7.1. Properties
    • 2.10.7.2. Natural graphite
      • 2.10.7.2.1. Classification
      • 2.10.7.2.2. Processing
      • 2.10.7.2.3. Flake
        • 2.10.7.2.3.1. Grades
        • 2.10.7.2.3.2. Applications
    • 2.10.7.3. Synthetic graphite
      • 2.10.7.3.1. Classification
        • 2.10.7.3.1.1. Primary synthetic graphite
        • 2.10.7.3.1.2. Secondary synthetic graphite
        • 2.10.7.3.1.3. Processing
    • 2.10.7.4. Applications as thermal interface materials
  • 2.10.8. Hexagonal Boron Nitride
    • 2.10.8.1. Properties
    • 2.10.8.2. Application as thermal interface materials
• 2.11. Metamaterials
  • 2.11.1. Types and properties
    • 2.11.1.1. Thermal metamaterials
    • 2.11.1.2. Electromagnetic metamaterials
      • 2.11.1.2.1. Double negative (DNG) metamaterials
      • 2.11.1.2.2. Single negative metamaterials
      • 2.11.1.2.3. Electromagnetic bandgap metamaterials (EBG)
      • 2.11.1.2.4. Bi-isotropic and bianisotropic metamaterials
      • 2.11.1.2.5. Chiral metamaterials
      • 2.11.1.2.6. Electromagnetic "Invisibility" cloak
    • 2.11.1.3. Terahertz metamaterials
    • 2.11.1.4. Photonic metamaterials
    • 2.11.1.5. Tunable metamaterials
    • 2.11.1.6. Frequency selective surface (FSS) based metamaterials
    • 2.11.1.7. Nonlinear metamaterials
    • 2.11.1.8. Acoustic metamaterials
  • 2.11.2. Application as thermal interface materials
• 2.12. Self-healing thermal interface materials
  • 2.12.1. Extrinsic self-healing
  • 2.12.2. Capsule-based
  • 2.12.3. Vascular self-healing
  • 2.12.4. Intrinsic self-healing
  • 2.12.5. Healing volume
  • 2.12.6. Types of self-healing materials, polymers and coatings
  • 2.12.7. Applications in thermal interface materials
• 2.13. Phase change thermal interface materials (PCTIMs)
  • 2.13.1. Thermal pads
  • 2.13.2. Low Melting Alloys (LMAs)
• 2.14. Global Market forecast 2020-2035

3. HEAT SPREADERS AND HEAT SINKS

• 3.1. Design
• 3.2. Materials
  • 3.2.1. Aluminum alloys
  • 3.2.2. Copper
  • 3.2.3. Metal foams
  • 3.2.4. Metal matrix composites
  • 3.2.5. Graphene
  • 3.2.6. Carbon foams and nanotubes
  • 3.2.7. Graphite
  • 3.2.8. Diamond
  • 3.2.9. Liquid immersion cooling
  • 3.2.10. Applications
• 3.3. Challenges
• 3.4. Market forecast

4. LIQUID COOLING SYSTEMS

• 4.1. Design
• 4.2. Types
• 4.3. Components of Liquid Cooling Systems
• 4.4. Cooling in Data Centers
  • 4.4.1. Rack Level
  • 4.4.2. Chip Level
• 4.5. Benefits
• 4.6. Challenges
• 4.7. Market forecast

5. AIR COOLING

• 5.1. Introduction
• 5.2. Air Cooling Methods
• 5.3. Commercial examples
• 5.4. Optimization of water and power consumption
• 5.5. Applications
• 5.6. Market forecast

6. COOLING PLATES

• 6.1. Overview
  • 6.1.1. Advanced cooling plates
  • 6.1.2. Roll Bond Aluminium Cold Plates
  • 6.1.3. Cold Plate Design
  • 6.1.4. Commercial examples
  • 6.1.5. Graphite heat spreaders
    • 6.1.5.1. Commercial examples
  • 6.1.6. Cold Plate/Direct to Chip Cooling
  • 6.1.7. Liquid Cooling Cold Plates
  • 6.1.8. Single-Phase Cold Plate
    • 6.1.8.1. Commercial examples
  • 6.1.9. Two-Phase Cold Plate
    • 6.1.9.1. Commercial examples
• 6.2. Design
• 6.3. Enhancement Techniques
  • 6.3.1. Cost
• 6.4. Applications
• 6.5. Market forecast

7. SPRAY COOLING

• 7.1. Overview
• 7.2. Heat Transfer Mechanisms
• 7.3. Spray Cooling Fluids
• 7.4. Applications
• 7.5. Market forecast

8. IMMERSION COOLING

• 8.1. Overview
• 8.2. Common immersion fluids
• 8.3. Benefits
• 8.4. Single-Phase Immersion Cooling
• 8.5. Two-Phase Immersion Cooling
• 8.6. Commercial examples
• 8.7. Costs
• 8.8. Challenges
• 8.9. Market forecast

9. THERMOELECTRIC COOLERS

• 9.1. Thermoelectric Modules
• 9.2. Performance Factors
• 9.3. Electronics Cooling

10. COOLANT FLUIDS

• 10.1. Overview
  • 10.1.1. Properties
    • 10.1.1.1. Electrical
    • 10.1.1.2. Corrosion
    • 10.1.1.3. Viscosity reduction
• 10.2. EVs
  • 10.2.1. Coolant Fluid Requirements
  • 10.2.2. Common EV Coolant Fluids
  • 10.2.3. Commercial examples
  • 10.2.4. Refrigerants for EVs
  • 10.2.5. EV coolant fluid trends
  • 10.2.6. Design Considerations
• 10.3. Growing adoption of immersion cooling
• 10.4. Market forecast

11. PHASE CHANGE MATERIALS

• 11.1. Properties of Phase Change Materials (PCMs)
• 11.2. Types
  • 11.2.1. Organic/biobased phase change materials
    • 11.2.1.1. Advantages and disadvantages
    • 11.2.1.2. Paraffin wax
    • 11.2.1.3. Non-Paraffins/Bio-based
  • 11.2.2. Inorganic phase change materials
    • 11.2.2.1. Salt hydrates
      • 11.2.2.1.1. Advantages and disadvantages
    • 11.2.2.2. Metal and metal alloy PCMs (High-temperature)
  • 11.2.3. Eutectic mixtures
  • 11.2.4. Encapsulation of PCMs
    • 11.2.4.1. Macroencapsulation
    • 11.2.4.2. Micro/nanoencapsulation
  • 11.2.5. Nanomaterial phase change materials
• 11.3. Thermal energy storage (TES)
  • 11.3.1. Sensible heat storage
  • 11.3.2. Latent heat storage
• 11.4. Battery Thermal Management
• 11.5. Market forecast

12. MARKETS FOR THERMAL MANAGEMENT MATERIALS AND SYSTEMS

• 12.1. Consumer electronics
  • 12.1.1. Market overview
  • 12.1.2. Market drivers
  • 12.1.3. Applications
    • 12.1.3.1. Smartphones and tablets
    • 12.1.3.2. Wearable electronics
  • 12.1.4. Global market revenues 2020-2035
• 12.2. Electric Vehicles (EV)
  • 12.2.1. Overview
  • 12.2.2. Electric vehicle thermal system architecture and components
  • 12.2.3. Commercial vehicle thermal management systems
    • 12.2.3.1. Transition to 800V architecture
  • 12.2.4. Market drivers
  • 12.2.5. EV Cooling
    • 12.2.5.1. Coolant Fluids
      • 12.2.5.1.1. Properties
      • 12.2.5.1.2. Integration of battery and eAxle cooling
    • 12.2.5.2. Refrigerants
      • 12.2.5.2.1. PFAS Free Refrigerants
      • 12.2.5.2.2. The integration of heat pump systems in EVs
    • 12.2.5.3. Active vs Passive Cooling
    • 12.2.5.4. Air Cooling
    • 12.2.5.5. Liquid Cooling
    • 12.2.5.6. Refrigerant Cooling
    • 12.2.5.7. Cell-to-pack designs
    • 12.2.5.8. Cell-to-chassis/body
    • 12.2.5.9. Immersion Cooling
      • 12.2.5.9.1. Phase Change Materials
      • 12.2.5.9.2. Commercial examples
      • 12.2.5.9.3. Operating Temperature
    • 12.2.5.10. Heat Spreaders and Cooling Plates
      • 12.2.5.10.1. Heat spreader technology
        • 12.2.5.10.1.1. Commercial examples
        • 12.2.5.10.1.2. Graphite Heat Spreaders
      • 12.2.5.10.2. Advanced cold plates
        • 12.2.5.10.2.1. Commercial examples
        • 12.2.5.10.2.2. Integration of cold plates into battery enclosures
      • 12.2.5.10.3. Polymer Heat Exchangers
    • 12.2.5.11. Coolant Hoses
    • 12.2.5.12. Thermal Interface Materials
    • 12.2.5.13. Fire Protection Materials
      • 12.2.5.13.1. Overview
      • 12.2.5.13.2. Thermal runaway in electric vehicles
      • 12.2.5.13.3. Vehicle fires
      • 12.2.5.13.4. Regulations
    • 12.2.5.14. Printed Sensors
    • 12.2.5.15. Other cooling
  • 12.2.6. Electric motors
    • 12.2.6.1. Air Cooling
    • 12.2.6.2. Water-glycol Cooling
    • 12.2.6.3. Oil Cooling
    • 12.2.6.4. Advanced cooling structures
      • 12.2.6.4.1. Refrigerant Cooling
      • 12.2.6.4.2. Immersion Cooling
    • 12.2.6.5. Motor Insulation and Encapsulation
      • 12.2.6.5.1. Commercial activity
      • 12.2.6.5.2. Axial Flux Motors
      • 12.2.6.5.3. In-wheel Motors
  • 12.2.7. Power electronics
    • 12.2.7.1. Overview
    • 12.2.7.2. Technology and materials evolution
    • 12.2.7.3. Power module packaging technology
    • 12.2.7.4. Single- vs Double-Sided Cooling
    • 12.2.7.5. TIMs in Power Electronics
      • 12.2.7.5.1. Thermal Interface Material 1 (TIM1)
      • 12.2.7.5.2. Thermal Interface Material 2 (TIM2)
    • 12.2.7.6. Wire Bonding
    • 12.2.7.7. Substrate Materials
    • 12.2.7.8. Cooling Power Electronics
      • 12.2.7.8.1. Inverter package cooling
      • 12.2.7.8.2. Direct cooling
  • 12.2.8. Charging stations
    • 12.2.8.1.1. Charging Levels
    • 12.2.8.1.2. Liquid Cooling
    • 12.2.8.1.3. Commercial examples
    • 12.2.8.1.4. Immersion Cooling
    • 12.2.8.2. Cabin heating
    • 12.2.8.3. Heat Pumps
  • 12.2.9. Global Market Revenues 2020-2035
• 12.3. Data Centers
  • 12.3.1. Market overview
  • 12.3.2. Market drivers
  • 12.3.3. Data Center thermal management requirements
    • 12.3.3.1. Increase in Thermal Design Power (TDP)
    • 12.3.3.2. Energy Efficiency
  • 12.3.4. Data Center Cooling
    • 12.3.4.1. Cooling Technology
    • 12.3.4.2. Air Cooling
    • 12.3.4.3. Hybrid Liquid-to-Air Cooling (L2A)
    • 12.3.4.4. Hybrid Liquid-to-Liquid Cooling (L2L)
    • 12.3.4.5. Hybrid Liquid-to-Refrigerant Cooling
    • 12.3.4.6. Hybrid Refrigerant-to-Refrigerant Cooling
    • 12.3.4.7. Thermal Interface Materials
      • 12.3.4.7.1. Data center power supplies
    • 12.3.4.8. Cold plates
    • 12.3.4.9. Spray Cooling
    • 12.3.4.10. Immersion Cooling
  • 12.3.5. Applications
    • 12.3.5.1. Router, switches and line cards
    • 12.3.5.2. Servers
    • 12.3.5.3. Power supply converters
  • 12.3.6. Global Market Revenues 2020-2035
• 12.4. ADAS Sensors
  • 12.4.1. Market overview
  • 12.4.2. Market drivers
  • 12.4.3. Applications
    • 12.4.3.1. ADAS Cameras
    • 12.4.3.2. ADAS Radar
    • 12.4.3.3. ADAS LiDAR
  • 12.4.4. Global Market Revenues 2020-2035
• 12.5. EMI shielding
  • 12.5.1. Market overview
  • 12.5.2. Market drivers
  • 12.5.3. Applications
  • 12.5.4. Global Market Revenues 2020-2035
• 12.6. 5G/6G
  • 12.6.1. Market overview
  • 12.6.2. Market drivers
  • 12.6.3. Applications
    • 12.6.3.1. Antenna
    • 12.6.3.2. Base Band Unit (BBU)
  • 12.6.4. Global Market Revenues 2020-2035
• 12.7. Aerospace
  • 12.7.1. Market overview
  • 12.7.2. Market drivers
  • 12.7.3. Applications
  • 12.7.4. Global Market Revenues 2020-2035
• 12.8. Energy systems
  • 12.8.1. Market overview
  • 12.8.2. Market drivers
  • 12.8.3. Applications
  • 12.8.4. Global Market Revenues 2020-2035
• 12.9. Other markets
  • 12.9.1. Advanced Robotics
    • 12.9.1.1. Design Considerations
    • 12.9.1.2. Implementation Strategies
    • 12.9.1.3. Advanced Cooling Technologies
    • 12.9.1.4. Environmental Considerations
    • 12.9.1.5. Future Trends

13. GLOBAL REVENUES

• 13.1. Global revenues 2023, by type
• 13.2. Global revenues 2024-2035, by materials type
  • 13.2.1. Telecommunications market
  • 13.2.2. Electronics and data centers market
  • 13.2.3. ADAS market
  • 13.2.4. Electric vehicles (EVs) market
• 13.3. By end-use market
• 13.4. By region

14. FUTURE MARKET OUTLOOK

15. COMPANY PROFILES (169 company profiles)

16. RESEARCH METHODOLOGY

17. REFERENCES

List of Tables

• Table 1. Comparison of active and passive thermal management
• Table 2. Air Cooling Systems Characteristics
• Table 3. Liquid Cooling System Characteristics
• Table 4. Vapor Compression System Characteristics
• Table 5. Spray Cooling System Characteristics
• Table 6. Hybrid Cooling System Characteristics
• Table 7. Types of thermal management materials and solutions
• Table 8. Thermal conductivities (k) of common metallic, carbon, and ceramic fillers employed in TIMs
• Table 9. Commercial TIMs and their properties
• Table 10. Advantages and disadvantages of TIMs, by type
• Table 11. Thermal interface materials prices
• Table 12. Characteristics of some typical TIMs
• Table 13. Properties of CNTs and comparable materials
• Table 14. Typical properties of SWCNT and MWCNT
• Table 15. Comparison of carbon-based additives in terms of the main parameters influencing their value proposition as a conductive additive
• Table 16. Thermal conductivity of CNT-based polymer composites
• Table 17. Comparative properties of BNNTs and CNTs
• Table 18. Properties of graphene, properties of competing materials, applications thereof
• Table 19. Properties of nanodiamonds
• Table 20. Comparison between Natural and Synthetic Graphite
• Table 21. Classification of natural graphite with its characteristics
• Table 22. Characteristics of synthetic graphite
• Table 23. Properties of hexagonal boron nitride (h-BN)
• Table 24. Comparison of self-healing systems
• Table 25. Types of self-healing coatings and materials
• Table 26. Comparative properties of self-healing materials
• Table 27. Benefits and drawbacks of PCMs in TIMs
• Table 28. Global Revenue Forecast for Thermal Interface Materials 2020-2035 (Millions USD)
• Table 29. Challenges with heat spreaders and heat sinks
• Table 30. Global Revenue Forecast for Heat Spreaders and Heat Sinks 2020- 2035 (Millions USD), by End Use
• Table 31. Comparison of Liquid Cooling Methods
• Table 32. Comparison of Liquid Cooling Technologies
• Table 33. Cooling System Components
• Table 34. Data Centers By Power
• Table 35. Rack Power and Cooling
• Table 36.Data Center Cooling Methods Comparison
• Table 37. Benefits of Liquid Cooling Systems
• Table 38. Challenges in Liquid Cooling Systems
• Table 39. Global Revenue Forecast for Liquid Cooling 2020- 2035 (Millions USD), by End Use
• Table 40. Air Cooling Methods
• Table 41. Applications of Air Cooling in Thermal Management
• Table 42. Global Revenue Forecast for Air Cooling 2020-2035 (Millions USD), by End Use
• Table 43. Benefits and Challenges of Cold Plate Cooling
• Table 44. Examples of Cold Plate Design
• Table 45. Cold Plate Requirements
• Table 46. Benefits and Drawbacks of Cold Plate Cooling
• Table 47. Thermal Cost Analysis of Cold Plate Systems
• Table 48. Global Revenue Forecast for Cooling Plates 2020- 2035 (Millions USD)
• Table 49. Applications of Spray Cooling in Thermal Management
• Table 50. Global Revenue Forecast for Spray Cooling 2020- 2035 (Millions USD)
• Table 51. Applications of Immersion Cooling in Thermal Management
• Table 52. Cost Comparison - Immersion and Air Cooling
• Table 53. Applications of Immersion Cooling
• Table 54. Pricing of Direct-to-Chip, Immersion and Air Cooling (US$/Watt)
• Table 55. Challenges in Immersion Cooling
• Table 56. Global Revenue Forecast for Immersion Cooling 2020- 2035 (Millions USD)
• Table 57. Thermoelectric Cooling in Electronics
• Table 58. Application of Coolant Fluids
• Table 59. Electrical Properties of Coolants
• Table 60. Coolant Fluid Comparison - Operating Temperature
• Table 61. Immersion Coolant Liquid Suppliers
• Table 62. Global Revenue Forecast for Coolant Fluids 2020- 2035 (Millions USD), by End Use
• Table 63. Common PCMs used in electronics cooling and their melting temperatures
• Table 64. Properties of PCMs
• Table 65. PCM Types and properties
• Table 66. Advantages and disadvantages of organic PCMs
• Table 67. Advantages and disadvantages of organic PCM Fatty Acids
• Table 68. Advantages and disadvantages of salt hydrates
• Table 69. Advantages and disadvantages of low melting point metals
• Table 70. Advantages and disadvantages of eutectics
• Table 71. Global Revenue Forecast for PCM Thermal Management Materials 2020- 2035 (Millions USD)
• Table 72. Market Drivers in consumer electronics
• Table 73. Applications and Thermal Management Materials Types in Consumer Electronics
• Table 74. Global Market Revenues for Thermal Management Materials in Consumer Electronics 2020-2035, by materials type
• Table 75. Thermal Management of EV Motors by OEM
• Table 76. EV Thermal System Companies
• Table 77. Applications and Types in EVs
• Table 78. Battery Thermal Management Strategy by OEM
• Table 79. Market Drivers for EV Thermal Management
• Table 80. Fluids per Vehicle Market Average 2023 vs 2035
• Table 81. EV Models with EV Specific Fluids
• Table 82. Coolants Properties Comparison
• Table 83. Refrigerant Content in EV Models
• Table 84. EV Refrigerant Forecast 2015-2035 (kg)
• Table 85. Battery Cooling Methods
• Table 86. Active Battery Cooling Methods
• Table 87. Passive Battery Cooling Methods
• Table 88. Commercial Liquid Cooling Comparison
• Table 89. Fluids in EVs
• Table 90. PCM Categories and Pros and Cons
• Table 91. PCM vs Battery
• Table 92. Operating Temperature Range of Commercial PCMs
• Table 93. Thermal Conductivity and Density Comparison of EV Battery PCMs
• Table 94. Cold Plate Design
• Table 95. Cold Plate Suppliers
• Table 96. Alternate Hose Materials
• Table 97. Types of Fire Protection Materials
• Table 98. Fire Protection Material Comparison
• Table 99. Density vs Thermal Conductivity for Fire Protection Materials
• Table 100. Fire Protection Materials Forecast (kg)
• Table 101. Cooling Electric Motors Strategies
• Table 102. Traction Motor Types
• Table 103. Motor Cooling Strategy by Power
• Table 104. Advanced Cooling Structures Comparison
• Table 105. Potting and Encapsulation Companies
• Table 106. Wide Bandgap (WBG) Semiconductor Advantages & Disadvantages
• Table 107. SiC Drives 800V Platforms
• Table 108. Market Share of Single and Double-Sided Cooling: 2024-2034
• Table 109. General Trend of TIMs in Power Electronics
• Table 110. Substrate materials properties
• Table 111. Comparison of Al2O3, ZTA, and Si3N4 Substrate
• Table 112. Inverter Liquid Cooling Forecast 2015-2035 (units)
• Table 113. Drivers for Direct Oil Cooling of Inverters
• Table 114. Commercial Direct Oil Cooling Activity
• Table 115. EV Charging Levels
• Table 116. Market Trends in EV Charging
• Table 117. Thermal Management Strategies in HPC
• Table 118.EVs with Heat Pumps
• Table 119. Global Market Revenues for Thermal Management Materials in Electric Vehicles 2020-2035
• Table 120. Overview of Thermal Management Methods for Data Centers
• Table 121. Market Drivers for thermal management in data centers
• Table 122. Data Center Equipment Overview
• Table 123. Historic Data of TDP - GPU
• Table 124. TDP Trend: Historic Data and Forecast Data - CPU
• Table 125. Data Center Server Rack and Server Structure
• Table 126. Comparison of Data Center Cooling Technology
• Table 127.Total TIM Area in Server Boards Forecast (m2): 2022-2035
• Table 128. TIM Consumption in Data Center Power Supplies
• Table 129.TIM Area for Power Supply Forecast (m2): 2025-2035
• Table 130. TIMs for Immersion Cooling
• Table 131. Applications and Types of thermal management materials and systems in data centers
• Table 132. Global Market Revenues for Thermal Management Materials in Data Centers 2020-2035
• Table 133. Market Drivers for thermal management in ADAS sensors
• Table 134. Applications and Types for thermal management in ADAS sensors
• Table 135. Global Market Revenues for Thermal Management Materials in ADAS Sensors 2020-2035
• Table 136. Market Drivers for thermal management in EMI shielding
• Table 137. Applications and Types for thermal management in EMI shielding
• Table 138. Global Market Revenues for Thermal Management Materials in EMI Shielding 2020-2035
• Table 139. Market Drivers for 5G//6G thermal management
• Table 140. 5G//6G thermal management Applications and Types
• Table 141. Global Market Revenues for Thermal Management Materials in 5G/6G 2020-2035
• Table 142. Market Drivers for thermal management in Aerospace
• Table 143. Thermal management in Aerospace Applications and Types
• Table 144. Global Market Revenues for Thermal Management Materials in Aerospace 2020-2035
• Table 145. Market Drivers for thermal management in energy systems
• Table 146. Thermal management in energy systems Applications and Types
• Table 147. Global Market Revenues for Thermal Management Materials in Energy Systems 2020-2035
• Table 148. Other Markets for Thermal Management Materials and Systems
• Table 149. Thermal Management by Robot Type
• Table 150. Global revenues for thermal management materials and systems, 2023, by type
• Table 151. Global Revenues for Thermal Management in Telecommunications, 2024-2035 ($M)
• Table 152. Global Revenues for Thermal Management in Electronics & Data Centers, 2024-2035 ($M)
• Table 153. Global Revenues for Thermal Management in ADAS, 2024-2035 ($M)
• Table 154. Global Revenues for Thermal Management in EVs, 2024-2035 ($M)
• Table 155. Global revenues for thermal management materials & systems, 2024-2035, by end use market (millions USD)
• Table 156. Global revenues for thermal management materials and systems 2024-2035, by region (millions USD)
• Table 157. Future Outlook for Thermal Management Materials and Systems
• Table 158. Carbodeon Ltd. Oy nanodiamond product list
• Table 159. CrodaTherm Range
• Table 160. Ray-Techniques Ltd. nanodiamonds product list
• Table 161. Comparison of ND produced by detonation and laser synthesis

List of Figures

• Figure 1. (L-R) Surface of a commercial heatsink surface at progressively higher magnifications, showing tool marks that create a rough surface and a need for a thermal interface material
• Figure 2. Schematic of thermal interface materials used in a flip chip package
• Figure 3. Thermal grease
• Figure 4. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module
• Figure 5. Application of thermal silicone grease
• Figure 6. A range of thermal grease products
• Figure 7. Thermal Pad
• Figure 8. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module
• Figure 9. Thermal tapes
• Figure 10. Thermal adhesive products
• Figure 11. Typical IC package construction identifying TIM1 and TIM2
• Figure 12. Liquid metal TIM product
• Figure 13. Pre-mixed SLH
• Figure 14. HLM paste and Liquid Metal Before and After Thermal Cycling
• Figure 15. SLH with Solid Solder Preform
• Figure 16. Automated process for SLH with solid solder preforms and liquid metal
• Figure 17. Schematic diagram of a multi-walled carbon nanotube (MWCNT)
• Figure 18. Schematic of single-walled carbon nanotube
• Figure 19. Types of single-walled carbon nanotubes
• Figure 20. Schematic of a vertically aligned carbon nanotube (VACNT) membrane used for water treatment
• Figure 21. Schematic of Boron Nitride nanotubes (BNNTs). Alternating B and N atoms are shown in blue and red
• Figure 22. Graphene layer structure schematic
• Figure 23. Illustrative procedure of the Scotch-tape based micromechanical cleavage of HOPG
• Figure 24. Graphene and its descendants: top right: graphene; top left: graphite = stacked graphene; bottom right: nanotube=rolled graphene; bottom left: fullerene=wrapped graphene
• Figure 25. Detonation Nanodiamond
• Figure 26. DND primary particles and properties
• Figure 27. Flake graphite
• Figure 28. Applications of flake graphite
• Figure 29. Graphite-based TIM products
• Figure 30. Structure of hexagonal boron nitride
• Figure 31. Classification of metamaterials based on functionalities
• Figure 32. Electromagnetic metamaterial
• Figure 33. Schematic of Electromagnetic Band Gap (EBG) structure
• Figure 34. Schematic of chiral metamaterials
• Figure 35. Nonlinear metamaterials- 400-nm thick nonlinear mirror that reflects frequency-doubled output using input light intensity as small as that of a laser pointer
• Figure 36. Schematic of self-healing polymers. Capsule based (a), vascular (b), and intrinsic (c) schemes for self-healing materials. Red and blue colours indicate chemical species which react (purple) to heal damage
• Figure 37. Stages of self-healing mechanism
• Figure 38. Self-healing mechanism in vascular self-healing systems
• Figure 39. PCM TIMs
• Figure 40. Phase Change Material - die cut pads ready for assembly
• Figure 41. Global Revenue Forecast for Thermal Interface Materials 2020- 2035 (Millions USD)
• Figure 42. Global Revenue Forecast for Heat Spreaders and Heat Sinks 2020- 2035 (Millions USD)
• Figure 43. Global Revenue Forecast for Liquid Cooling 2020- 2035 (Millions USD)
• Figure 44. Global Revenue Forecast for Air Cooling 2020- 2035 (Millions USD), by End Use
• Figure 45. Direct Water-Cooled Server
• Figure 46. Global Revenue Forecast for Cooling Plates 2020- 2035 (Millions USD)
• Figure 47. Global Revenue Forecast for Spray Cooling 2020- 2035 (Millions USD)
• Figure 48. Roadmap of Single-Phase Immersion Cooling
• Figure 49. Roadmap of Two-Phase Immersion Cooling
• Figure 50. Global Revenue Forecast for Immersion Cooling 2020- 2035 (Millions USD)
• Figure 51. Global Revenue Forecast for Coolant Fluids 2020- 2035 (Millions USD)
• Figure 52. Phase-change TIM products
• Figure 53. PCM mode of operation
• Figure 54. Classification of PCMs
• Figure 55. Phase-change materials in their original states
• Figure 56. Thermal energy storage materials
• Figure 57. Phase Change Material transient behaviour
• Figure 58. Global Revenue Forecast for PCM Thermal Management Materials 2020- 2035 (Millions USD)
• Figure 59. Schematic of TIM operation in electronic devices
• Figure 60. Schematic of Thermal Management Materials in smartphone
• Figure 61. Wearable technology inventions
• Figure 62. Global Market Revenues for Thermal Management Materials in Consumer Electronics 2020-2035, by materials type
• Figure 63. Application of thermal interface materials in automobiles
• Figure 64. Battery pack with a cell-to-pack design and prismatic cells
• Figure 65. Cell-to-chassis battery pack
• Figure 66. Application of thermal interface materials in automobiles
• Figure 67. EV battery components including TIMs
• Figure 68. Axial Flux Motor
• Figure 69. Exploded view of In-Wheel Motor
• Figure 70. TIMS in EV charging station
• Figure 71. Global Market Revenues for Thermal Management Materials in Electric Vehicles 2020-2035
• Figure 72. Image of data center layout
• Figure 73. Application of TIMs in line card
• Figure 74. Global Market Revenues for Thermal Management Materials in Data Centers 2020-2035
• Figure 75. ADAS radar unit incorporating TIMs
• Figure 76. Global Market Revenues for Thermal Management Materials in ADAS Sensors 2020-2035
• Figure 77. Coolzorb 5G
• Figure 78. Global Market Revenues for Thermal Management Materials in EMI Shielding 2020-2035
• Figure 79. TIMs in Base Band Unit (BBU)
• Figure 80. Global Market Revenues for Thermal Management Materials in 5G/6G 2020-2035
• Figure 81. Global Market Revenues for Thermal Management Materials in Aerospace 2020-2035
• Figure 82. Global Market Revenues for Thermal Management Materials in Energy Systems 2020-2035
• Figure 83. Global revenues for thermal management materials and systems in telecommuncations, 2024-2035, by type
• Figure 84. Global revenues for thermal management materials and systems in electronics & data centers, 2024-2035, by type
• Figure 85. Global revenues for thermal management materials and systems in ADAS, 2024-2035, by type
• Figure 86. Global revenues for thermal management materials and systems in Electric Vehicles (EVs), 2024-2035, by type
• Figure 87. Global revenues for thermal management materials and systems 2024-2035, by market
• Figure 88. Global revenues for thermal management materials and systems 2024-2035, by region (millions USD)
• Figure 89. Boron Nitride Nanotubes products
• Figure 90. Transtherm-R PCMs
• Figure 91. Carbice carbon nanotubes
• Figure 92. Internal structure of carbon nanotube adhesive sheet
• Figure 93. Carbon nanotube adhesive sheet
• Figure 94. HI-FLOW Phase Change Materials
• Figure 95. Thermoelectric foil, consists of a sequence of semiconductor elements connected with conductive metal. At the top (in red) is the thermal interface
• Figure 96. Parker Chomerics THERM-A-GAP GEL
• Figure 97. CredoTM ProMed transport bags
• Figure 98. Metamaterial structure used to control thermal emission
• Figure 99. Shinko Carbon Nanotube TIM product
• Figure 100. The Sixth Element graphene products
• Figure 101. Thermal conductive graphene film
• Figure 102. VB Series of TIMS from Zeon