The Global Market for Thermal Interface Materials 2024-2035

TABLE OF CONTENTS

1. INTRODUCTION

• 1.1. Thermal management-active and passive
• 1.2. What are thermal interface materials (TIMs)?
  • 1.2.1. Types
  • 1.2.2. Thermal conductivity
• 1.3. Comparative properties of TIMs
• 1.4. Differences between thermal pads and grease
• 1.5. Advantages and disadvantages of TIMs, by type
• 1.6. Performance
• 1.7. Prices

2. MATERIALS

• 2.1. Advanced and Multi-Functional TIMs
• 2.2. TIM fillers
  • 2.2.1. Trends
  • 2.2.2. Pros and Cons
  • 2.2.3. Thermal Conductivity
  • 2.2.4. Spherical Alumina
  • 2.2.5. Alumina Fillers
  • 2.2.6. Boron nitride (BN)
  • 2.2.7. Filler and polymer TIMs
  • 2.2.8. Filler Sizes
• 2.3. Thermal greases and pastes
  • 2.3.1. Overview and properties
  • 2.3.2. SWOT analysis
• 2.4. Thermal gap pads
  • 2.4.1. Overview and properties
  • 2.4.2. SWOT analysis
• 2.5. Thermal gap fillers
  • 2.5.1. Overview and properties
  • 2.5.2. SWOT analysis
• 2.6. Potting compounds/encapsulants
  • 2.6.1. Overview and properties
  • 2.6.2. SWOT analysis
• 2.7. Adhesive Tapes
  • 2.7.1. Overview and properties
  • 2.7.2. SWOT analysis
• 2.8. Phase Change Materials
  • 2.8.1. Overview and properties
  • 2.8.2. Types
    • 2.8.2.1. Organic/biobased phase change materials
      • 2.8.2.1.1. Advantages and disadvantages
      • 2.8.2.1.2. Paraffin wax
      • 2.8.2.1.3. Non-Paraffins/Bio-based
    • 2.8.2.2. Inorganic phase change materials
      • 2.8.2.2.1. Salt hydrates
        • 2.8.2.2.1.1. Advantages and disadvantages
      • 2.8.2.2.2. Metal and metal alloy PCMs (High-temperature)
    • 2.8.2.3. Eutectic mixtures
    • 2.8.2.4. Encapsulation of PCMs
      • 2.8.2.4.1. Macroencapsulation
      • 2.8.2.4.2. Micro/nanoencapsulation
    • 2.8.2.5. Nanomaterial phase change materials
  • 2.8.3. Thermal energy storage (TES)
    • 2.8.3.1. Sensible heat storage
    • 2.8.3.2. Latent heat storage
  • 2.8.4. Application in TIMs
    • 2.8.4.1. Thermal pads
    • 2.8.4.2. Low Melting Alloys (LMAs)
  • 2.8.5. SWOT analysis
• 2.9. Metal-based TIMs
  • 2.9.1. Overview
  • 2.9.2. Solders and low melting temperature alloy TIMs
    • 2.9.2.1. Solder TIM1
    • 2.9.2.2. Sintering
  • 2.9.3. Liquid metals
  • 2.9.4. Solid liquid hybrid (SLH) metals
    • 2.9.4.1. Hybrid liquid metal pastes
    • 2.9.4.2. SLH created during chip assembly (m2TIMs)
    • 2.9.4.3. Die-attach materials
      • 2.9.4.3.1. Solder Alloys and Conductive Adhesives
      • 2.9.4.3.2. Silver-Sintered Paste
      • 2.9.4.3.3. Copper (Cu) sintered TIMs
      • 2.9.4.3.4. Sintered Copper Die-Bonding Paste
  • 2.9.5. SWOT analysis
• 2.10. Carbon-based TIMs
  • 2.10.1. Carbon nanotube (CNT) TIM Fabrication
  • 2.10.2. Multi-walled nanotubes (MWCNT)
    • 2.10.2.1. Properties
    • 2.10.2.2. Application as thermal interface materials
  • 2.10.3. Single-walled carbon nanotubes (SWCNTs)
    • 2.10.3.1. Properties
    • 2.10.3.2. Application as thermal interface materials
  • 2.10.4. Vertically aligned CNTs (VACNTs)
    • 2.10.4.1. Properties
    • 2.10.4.2. Applications
    • 2.10.4.3. Application as thermal interface materials
  • 2.10.5. BN nanotubes (BNNT) and nanosheets (BNNS)
    • 2.10.5.1. Properties
    • 2.10.5.2. Application as thermal interface materials
  • 2.10.6. Graphene
    • 2.10.6.1. Properties
    • 2.10.6.2. Application as thermal interface materials
      • 2.10.6.2.1. Graphene fillers
      • 2.10.6.2.2. Graphene foam
      • 2.10.6.2.3. Graphene aerogel
      • 2.10.6.2.4. Graphene Heat Spreaders
      • 2.10.6.2.5. Graphene in Thermal Interface Pads
  • 2.10.7. Nanodiamonds
    • 2.10.7.1. Properties
    • 2.10.7.2. Application as thermal interface materials
  • 2.10.8. Graphite
    • 2.10.8.1. Properties
    • 2.10.8.2. Natural graphite
      • 2.10.8.2.1. Classification
      • 2.10.8.2.2. Processing
      • 2.10.8.2.3. Flake
        • 2.10.8.2.3.1. Grades
        • 2.10.8.2.3.2. Applications
    • 2.10.8.3. Synthetic graphite
      • 2.10.8.3.1. Classification
        • 2.10.8.3.1.1. Primary synthetic graphite
        • 2.10.8.3.1.2. Secondary synthetic graphite
        • 2.10.8.3.1.3. Processing
    • 2.10.8.4. Applications as thermal interface materials
      • 2.10.8.4.1. Graphite Sheets
      • 2.10.8.4.2. Vertical graphite
      • 2.10.8.4.3. Graphite pastes
  • 2.10.9. Hexagonal Boron Nitride
    • 2.10.9.1. Properties
    • 2.10.9.2. Application as thermal interface materials
  • 2.10.10. SWOT analysis
• 2.11. Metamaterials
  • 2.11.1. Types and properties
    • 2.11.1.1. Electromagnetic metamaterials
      • 2.11.1.1.1. Double negative (DNG) metamaterials
      • 2.11.1.1.2. Single negative metamaterials
      • 2.11.1.1.3. Electromagnetic bandgap metamaterials (EBG)
      • 2.11.1.1.4. Bi-isotropic and bianisotropic metamaterials
      • 2.11.1.1.5. Chiral metamaterials
      • 2.11.1.1.6. Electromagnetic "Invisibility" cloak
    • 2.11.1.2. Terahertz metamaterials
    • 2.11.1.3. Photonic metamaterials
    • 2.11.1.4. Tunable metamaterials
    • 2.11.1.5. Frequency selective surface (FSS) based metamaterials
    • 2.11.1.6. Nonlinear metamaterials
    • 2.11.1.7. Acoustic metamaterials
  • 2.11.2. Application as thermal interface materials
• 2.12. Self-healing thermal interface materials
  • 2.12.1. Extrinsic self-healing
  • 2.12.2. Capsule-based
  • 2.12.3. Vascular self-healing
  • 2.12.4. Intrinsic self-healing
  • 2.12.5. Healing volume
  • 2.12.6. Types of self-healing materials, polymers and coatings
  • 2.12.7. Applications in thermal interface materials
• 2.13. TIM Dispensing
  • 2.13.1. Low-volume Dispensing Methods
  • 2.13.2. High-volume Dispensing Methods
  • 2.13.3. Meter, Mix, Dispense (MMD) Systems
  • 2.13.4. TIM Dispensing Equipment Suppliers

3. MARKETS FOR THERMAL INTERFACE MATERIALS (TIMs)

• 3.1. Consumer electronics
  • 3.1.1. Market overview
    • 3.1.1.1. Market drivers
    • 3.1.1.2. Applications
      • 3.1.1.2.1. Smartphones and tablets
      • 3.1.1.2.2. Wearable electronics
  • 3.1.2. Global market 2022-2035, by TIM type
• 3.2. Electric Vehicles (EV)
  • 3.2.1. Market overview
    • 3.2.1.1. Market drivers
    • 3.2.1.2. Applications
      • 3.2.1.2.1. Lithium-ion batteries
        • 3.2.1.2.1.1. Cell-to-pack designs
        • 3.2.1.2.1.2. Cell-to-chassis/body
      • 3.2.1.2.2. Power electronics
        • 3.2.1.2.2.1. Types
        • 3.2.1.2.2.2. Properties for EV power electronics
        • 3.2.1.2.2.3. TIM2 in SiC MOSFET
      • 3.2.1.2.3. Charging stations
  • 3.2.2. Global market 2022-2035, by TIM type
• 3.3. Data Centers
  • 3.3.1. Market overview
    • 3.3.1.1. Market drivers
    • 3.3.1.2. Applications
      • 3.3.1.2.1. Router, switches and line cards
        • 3.3.1.2.1.1. Transceivers
        • 3.3.1.2.1.2. Server Boards
        • 3.3.1.2.1.3. Switches and Routers
      • 3.3.1.2.2. Servers
      • 3.3.1.2.3. Power supply converters
  • 3.3.2. Global market 2022-2035, by TIM type
• 3.4. ADAS Sensors
  • 3.4.1. Market overview
    • 3.4.1.1. Market drivers
    • 3.4.1.2. Applications
      • 3.4.1.2.1. ADAS Cameras
        • 3.4.1.2.1.1. Commercial examples
      • 3.4.1.2.2. ADAS Radar
        • 3.4.1.2.2.1. Radar technology
        • 3.4.1.2.2.2. Radar boards
        • 3.4.1.2.2.3. Commercial examples
      • 3.4.1.2.3. ADAS LiDAR
        • 3.4.1.2.3.1. Role of TIMs
        • 3.4.1.2.3.2. Commercial examples
      • 3.4.1.2.4. Electronic control units (ECUs) and computers
        • 3.4.1.2.4.1. Commercial examples
      • 3.4.1.2.5. Die attach materials
      • 3.4.1.2.6. Commercial examples
  • 3.4.2. Global market 2022-2035, by TIM type
• 3.5. EMI shielding
  • 3.5.1. Market overview
    • 3.5.1.1. Market drivers
    • 3.5.1.2. Applications
      • 3.5.1.2.1. Dielectric Constant
      • 3.5.1.2.2. ADAS
        • 3.5.1.2.2.1. Radar
        • 3.5.1.2.2.2. 5G
      • 3.5.1.2.3. Commercial examples
• 3.6. 5G
  • 3.6.1. Market overview
    • 3.6.1.1. Market drivers
    • 3.6.1.2. Applications
      • 3.6.1.2.1. EMI shielding and EMI gaskets
      • 3.6.1.2.2. Antenna
      • 3.6.1.2.3. Base Band Unit (BBU)
      • 3.6.1.2.4. Liquid TIMs
      • 3.6.1.2.5. Power supplies
        • 3.6.1.2.5.1. Increased power consumption in 5G
  • 3.6.2. Market players
  • 3.6.3. Global market 2022-2035, by TIM type

4. COMPANY PROFILES (104 company profiles)

5. RESEARCH METHODOLOGY

6. REFERENCES

List of Tables

• Table 1. Thermal conductivities (k) of common metallic, carbon, and ceramic fillers employed in TIMs
• Table 2. Commercial TIMs and their properties
• Table 3. Advantages and disadvantages of TIMs, by type
• Table 4. Key Factors in System Level Performance for TIMs
• Table 5. Thermal interface materials prices
• Table 6. Comparisons of Price and Thermal Conductivity for TIMs
• Table 7. Price Comparison of TIM Fillers
• Table 8. Characteristics of some typical TIMs
• Table 9. Trends on TIM Fillers
• Table 10. Pros and Cons of TIM Fillers
• Table 11. Types of Potting Compounds/Encapsulants
• Table 12. TIM adhesives tapes
• Table 13. Properties of PCMs
• Table 14. PCM Types and properties
• Table 15. Advantages and disadvantages of organic PCMs
• Table 16. Advantages and disadvantages of organic PCM Fatty Acids
• Table 17. Advantages and disadvantages of salt hydrates
• Table 18. Advantages and disadvantages of low melting point metals
• Table 19. Advantages and disadvantages of eutectics
• Table 20. Benefits and drawbacks of PCMs in TIMs
• Table 21. Comparison of Carbon-based TIMs
• Table 22. Properties of CNTs and comparable materials
• Table 23. Typical properties of SWCNT and MWCNT
• Table 24. Comparison of carbon-based additives in terms of the main parameters influencing their value proposition as a conductive additive
• Table 25. Thermal conductivity of CNT-based polymer composites
• Table 26. Comparative properties of BNNTs and CNTs
• Table 27. Properties of graphene, properties of competing materials, applications thereof
• Table 28. Properties of nanodiamonds
• Table 29. Comparison between Natural and Synthetic Graphite
• Table 30. Classification of natural graphite with its characteristics
• Table 31. Characteristics of synthetic graphite
• Table 32. Thermal Conductivity Comparison of Graphite TIMs
• Table 33. Properties of hexagonal boron nitride (h-BN)
• Table 34. Comparison of self-healing systems
• Table 35. Types of self-healing coatings and materials
• Table 36. Comparative properties of self-healing materials
• Table 37. Challenges for Dispensing TIM
• Table 38. Thermal Management Application Areas in Consumer Electronics
• Table 39. Trends in Smartphone Thermal Materials
• Table 40. Thermal Management approaches in commercial Smartphones
• Table 41. Global market in consumer electronics 2022-2035, by TIM type (millions USD)
• Table 42. Global market in electric vehicles 2022-2035, by TIM type (millions USD)
• Table 43. TIM Trends in Data Centers
• Table 44. TIM Area Forecast in Server Boards: 2022-2035 (m2)
• Table 45. Global market in data centers 2022-2035, by TIM type (millions USD)
• Table 46. TIM Players in ADAS
• Table 47. Die Attach for ADAS Sensors
• Table 48. Die Attach Area Forecast for Key Components Within ADAS Sensors: 2022-2035 (m2)
• Table 49. Global market in ADAS sensors 2022-2035, by TIM type (millions USD)
• Table 50. TIM Area Forecast for 5G Antennas by Station Size: 2022-2035 (m2)
• Table 51. TIM Area Forecast for 5G Antennas by Station Frequency: 2022-2035 (m2)
• Table 52. TIMS in BBU
• Table 53. 5G BBY models
• Table 54. TIM Area Forecast for 5G BBU: 2022-2035 (m2)
• Table 55. Power Consumption Forecast for 5G: 2022-2035 (GW)
• Table 56. TIM Area Forecast for Power Supplies: 2022-2035 (m2)
• Table 57. TIM market players in 5G
• Table 58. Global market in 5G 2022-2035, by TIM type (millions USD)

List of Figures

• Figure 1. (L-R) Surface of a commercial heatsink surface at progressively higher magnifications, showing tool marks that create a rough surface and a need for a thermal interface material
• Figure 2. Schematic of thermal interface materials used in a flip chip package
• Figure 3. Thermal grease
• Figure 4. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module
• Figure 5. Application of thermal silicone grease
• Figure 6. A range of thermal grease products
• Figure 7. SWOT analysis for thermal greases and pastes
• Figure 8. Thermal Pad
• Figure 9. SWOT analysis for thermal gap pads
• Figure 10. Dispensing a bead of silicone-based gap filler onto the heat sink of a power electronics module
• Figure 11. SWOT analysis for thermal gap fillers
• Figure 12. SWOT analysis for Potting compounds/encapsulants
• Figure 13. Thermal adhesive products
• Figure 14. SWOT analysis for TIM adhesives tapes
• Figure 15. Phase-change TIM products
• Figure 16. PCM mode of operation
• Figure 17. Classification of PCMs
• Figure 18. Phase-change materials in their original states
• Figure 19. Thermal energy storage materials
• Figure 20. Phase Change Material transient behaviour
• Figure 21. PCM TIMs
• Figure 22. Phase Change Material - die cut pads ready for assembly
• Figure 23. SWOT analysis for phase change materials
• Figure 24. Typical IC package construction identifying TIM1 and TIM2
• Figure 25. Liquid metal TIM product
• Figure 26. Pre-mixed SLH
• Figure 27. HLM paste and Liquid Metal Before and After Thermal Cycling
• Figure 28. SLH with Solid Solder Preform
• Figure 29. Automated process for SLH with solid solder preforms and liquid metal
• Figure 30. SWOT analysis for metal-based TIMs
• Figure 31. Schematic diagram of a multi-walled carbon nanotube (MWCNT)
• Figure 32. Schematic of single-walled carbon nanotube
• Figure 33. Types of single-walled carbon nanotubes
• Figure 34. Schematic of a vertically aligned carbon nanotube (VACNT) membrane used for water treatment
• Figure 35. Schematic of Boron Nitride nanotubes (BNNTs). Alternating B and N atoms are shown in blue and red
• Figure 36. Graphene layer structure schematic
• Figure 37. Illustrative procedure of the Scotch-tape based micromechanical cleavage of HOPG
• Figure 38. Graphene and its descendants: top right: graphene; top left: graphite = stacked graphene; bottom right: nanotube=rolled graphene; bottom left: fullerene=wrapped graphene
• Figure 39. Flake graphite
• Figure 40. Applications of flake graphite
• Figure 41. Graphite-based TIM products
• Figure 42. Structure of hexagonal boron nitride
• Figure 43. SWOT analysis for carbon-based TIMs
• Figure 44. Classification of metamaterials based on functionalities
• Figure 45. Electromagnetic metamaterial
• Figure 46. Schematic of Electromagnetic Band Gap (EBG) structure
• Figure 47. Schematic of chiral metamaterials
• Figure 48. Nonlinear metamaterials- 400-nm thick nonlinear mirror that reflects frequency-doubled output using input light intensity as small as that of a laser pointer
• Figure 49. Schematic of self-healing polymers. Capsule based (a), vascular (b), and intrinsic (c) schemes for self-healing materials. Red and blue colours indicate chemical species which react (purple) to heal damage
• Figure 50. Stages of self-healing mechanism
• Figure 51. Self-healing mechanism in vascular self-healing systems
• Figure 52. Schematic of TIM operation in electronic devices
• Figure 53. Schematic of Thermal Management Materials in smartphone
• Figure 54. Wearable technology inventions
• Figure 55. Global market in consumer electronics 2022-2035, by TIM type (millions USD)
• Figure 56. Application of thermal interface materials in automobiles
• Figure 57. EV battery components including TIMs
• Figure 58. Battery pack with a cell-to-pack design and prismatic cells
• Figure 59. Cell-to-chassis battery pack
• Figure 60. TIMS in EV charging station
• Figure 61. Global market in electric vehicles 2022-2035, by TIM type (millions USD)
• Figure 62. Image of data center layout
• Figure 63. Application of TIMs in line card
• Figure 64. Global market in data centers 2022-2035, by TIM type (millions USD)
• Figure 65. ADAS radar unit incorporating TIMs
• Figure 66. Global market in ADAS sensors 2022-2035, by TIM type (millions USD)
• Figure 67. Coolzorb 5G
• Figure 68. TIMs in Base Band Unit (BBU)
• Figure 69. Global market in 5G 2022-2035, by TIM type (millions USD)
• Figure 70. Boron Nitride Nanotubes products
• Figure 71. Transtherm-R PCMs
• Figure 72. Carbice carbon nanotubes
• Figure 73. Internal structure of carbon nanotube adhesive sheet
• Figure 74. Carbon nanotube adhesive sheet
• Figure 75. HI-FLOW Phase Change Materials
• Figure 76. Thermoelectric foil, consists of a sequence of semiconductor elements connected with conductive metal. At the top (in red) is the thermal interface
• Figure 77. Parker Chomerics THERM-A-GAP GEL
• Figure 78. Metamaterial structure used to control thermal emission
• Figure 79. Shinko Carbon Nanotube TIM product
• Figure 80. The Sixth Element graphene products
• Figure 81. Thermal conductive graphene film
• Figure 82. VB Series of TIMS from Zeon