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PUBLISHER: DataM Intelligence | PRODUCT CODE: 1459346

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PUBLISHER: DataM Intelligence | PRODUCT CODE: 1459346

Global Failure Analysis Market - 2024-2031

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PAGES: 280 Pages
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Overview

Global Failure Analysis Market reached US$ 5.1 Billion in 2023 and is expected to reach US$ 9.5 Billion by 2031, growing with a CAGR of 8.2% during the forecast period 2024-2031.

The likelihood of product failures rises with product complexity, including miniaturization and complicated designs. The complexity affects the industrial, automotive, aerospace, electronics and healthcare sectors. To determine the root cause of failures and ensure the dependability and functionality of these complex structures, failure analysis is crucial. High quality and safety standards are enforced by industry associations and regulatory agencies to guarantee product conformity, safety and dependability. By locating shortcomings weaknesses and failure modes in materials, components and systems, failure analysis is essential to fulfilling these requirements. Strict restrictions in the automobile, aerospace, medical device and pharmaceutical industries have increased demand for failure analysis services and solutions.

To fulfill consumers increased demand for failure analysis solutions some of the major key players in the market are expanding their business globally. For instance, on September 01, 2023, NEOTech, an electronic manufacturing service provider expanded its failure analysis laboratory in Mexico to provide customers with enhanced levels of product quality assurance. NEOTech has shown its commitment to investing in cutting-edge equipment, enabling it to provide best-in-class services. Customers of NEOTech are guaranteed to maintain their products' competitive edge because of this dedication to quality.

Asia-Pacific is the dominating region in the market due to the growing technologically advanced failure analysis product launches by major key players in the region over the forecast period. For instance, on August 08, 2021, Joel Ltd. launched semi-in-lens versions (i)/(is) which are optimal for the observation of semiconductor devices of the Schottky Field Emission Electron Microscope JSM-IT800.

By merging electron beams with the powerful magnetic field lens that forms below the objective lens, a semi-in-lens produces extremely high resolution. Additionally, the device effectively gathers the low-energy secondary electrons released from a sample and uses the upper in-lens detector (UID) to detect the electrons. As a result, it makes it possible to see and analyze inclined and cross-sectional specimens at high resolution, which is necessary for semiconductor device failure investigation.

Dynamics

Stringent Regulatory Standards

Mandatory compliance requirements are imposed on manufacturers and suppliers by regulatory bodies, including the Food and Drug Administration (FDA), European Medicines Agency (EMA), Federal Aviation Administration (FAA), International Organization for Standardization (ISO) and several industry-specific regulatory agencies. To guarantee regulatory compliance, these criteria frequently involve strict quality control methods, product testing procedures and failure analysis procedures. To achieve and sustain compliance, businesses are advised to invest in failure analysis services and solutions.

For instance, the Central Drug Standard Control Organization or CDSCO, is the regulatory organization in India that oversees various medical devices. Every medical device that wants to be propagated or promoted in India must first receive authorization from the CDSCO before being allowed to be marketed. The CDSCO conforms with all applicable laws, rules and regulations about the medical device industry. Thousands of people apply for registration each year. Due to this, regulations are becoming more strict these days to guarantee that only products that benefit people are sold. One of the healthcare products on the CDSCO-released list of non-notified medical devices that require registration is a microscope.

Technological Advancements in Analytical and Imaging

Technological developments in microscopy like transmission electron microscopy and scanning electron microscopy, have improved quality. Analysts can determine failure processes and root causes via higher-resolution imaging to see minute features and imperfections in materials and components. Interpreting complex 3-D structures is more challenging when using conventional imaging techniques, which usually offer 2-D images of materials. Three-dimensional imaging of materials and components is made possible by advanced imaging methods such as computed tomography and confocal microscopy, among others. By exposing underlying structures and spatial connections, three-dimensional visualization improves the accuracy of failure analysis.

Researchers can see material behavior and failure mechanisms in real-world settings by using in-situ testing and analysis methods. Methods like in-situ TEM and in-situ spectroscopy allow the dynamic monitoring of samples under different environmental exposures such as heat cycling, mechanical stress, corrosion and others. Researchers create prediction models for failure analysis with the use of in-situ analysis, which offers insightful information about the evolution of failure processes.

High Ownership and Maintenance Cost

It typically requires a substantial initial expenditure of funds to purchase sophisticated failure analysis tools like transmission electron microscopes (TEMs), focused ion beam (FIB) systems and scanning electron microscopes (SEMs). It may be difficult for many organizations, especially smaller ones or research facilities with smaller resources, to uphold the initial cost required for purchasing such technology.

Failure analysis equipment frequently requires continuing maintenance and servicing costs beyond the initial purchase. The covers the expenses of doing regular maintenance to ensure optimal efficiency as well as the price of replacing or repairing aging components. Throughout the equipment's life, these maintenance expenses can add up and raise the overall cost of ownership. Expertise in particular fields is frequently needed to use and maintain sophisticated failure analysis equipment. To guarantee that the equipment is operated and maintained properly organizations would need to make training program investments or recruit competent staff. The lack of qualified engineers or technicians with experience in failure analysis methods might raise labor expenses further and raise the total cost of ownership.

Segment Analysis

The global failure analysis market is segmented based on technology, equipment, test, end-user and region.

Growing Adoption of Failure Analysis Software Globally

Based on the Technology, the failure analysis market is segmented into Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Focused Ion Beam (FIB), Energy-dispersive X-ray spectroscopy (EDS), X-ray Photoelectron Spectroscopy (XPS) and Others. With the use of SEM's high-resolution imaging capabilities, analysts study sample surfaces with resolution down to the nanoscale. The is ideal for identifying the fundamental causes of various materials and component failures as it allows the examination of microstructures and failure locations. SEM has a broad depth of focus in comparison to other microscopy techniques, which enables it to examine materials with uneven or rough surfaces. Due to this, SEM is very useful for analyzing complex structures and identifying small imperfections that could lead to failures.

Through the use of this skill, analysts may determine the chemical makeup of materials and locate impurities or contaminants that cause failures. Several substances, including biological specimens and ceramics, metals and semiconductors, were analyzed employing scanning electron microscopy. Over the projection period, the leading important players' increasing number of product launches contribute to the growth of the market. For instance, on January 29, 2021, Emory University, launched Energy-Dispersive Spectroscopy for elemental analysis. Particular substances and their relative percentages in different sections of a sample can be determined by combining the current scanning electron microscope (SEM) with an EDS system. EDS makes use of the idea that each element's related atomic structure produces a unique peak profile on an X-ray spectrum.

Geographical Penetration

Asia-Pacific is Dominating the Failure Analysis Market

Asia-Pacific is a significant center for manufacturing across several industries, such as consumer products, automobiles and aerospace. Because of the robust manufacturing sector in the region, which requires product quality and conformance to industry standards, failure analysis services are in high demand. Leading semiconductor producers, suppliers of electronic components and technological companies that promote technical innovation and breakthroughs in failure analysis methods and instruments are based in Asia-Pacific. The region's importance in the globally failure analysis market is attributed to its proficiency in electronics and semiconductor production.

The demand for failure analysis services has increased in response to the rapid industrialization and economic expansion of countries like China, Japan, South Korea and Taiwan, which has helped in the creation and manufacturing of cutting-edge goods and technology. Failure analysis is becoming increasingly necessary as the region's businesses modernize and use sophisticated production techniques to identify and mitigate risks.

Competitive Landscape.

The major global players in the market include Keysight Technologies, Anritsu Corporation, TUV SUD, NEC Corporation, L3Harris Technologies, Inc., Smiths Interconnect, Intertech Group Plc., TEC Materials Testing, McDowell Owens Engineering Inc., Panacea Engineers and Metallurgical Engineering Services, Inc.

COVID-19 Impact Analysis

The pandemic produced delays in the delivery of components, tools and supplies needed for failure analysis procedures by upsetting globally supply networks. Travel restrictions and interruptions to business operations led to shortages and logistical problems that impacted the velocity of failure analysis services. The pandemic's impact on consumer spending and financial instability contributed to a reduction in demand for products and services in several industries, including electronics, automotive and aerospace.

Money and resources were diverted from failure analysis programs, especially in areas of the economy that were directly grasped by pandemic response activities. For failure analysis service providers and their clients, the shift to remote labor presented difficulties, especially in sectors where on-site inspections and practical testing are crucial. The use of remote work arrangements has resulted in obstacles to cooperation, communication and physical inspection capabilities, ultimately causing delays and inefficiencies in failure analysis processes.

Russia-Ukraine War Impact Analysis

Significant suppliers of raw materials, parts and technology to a variety of industries, including electronics, semiconductor manufacturing, aerospace and defense, contain Russia and Ukraine. Any disruption in the conflict's supply chain might result in shortages of vital supplies or parts, which would interfere with production plans and cause failure analysis studies to be postponed. The conflict's unpredictability might cause price volatility in the world's commodities markets, which include those for energy resources, metals and minerals. Price fluctuations affect the supplies and equipment required for failure analysis procedures, which result in increased operational costs for market participants.

Global trade relations and regulatory environments are impacted by geopolitical tensions emerging from the conflict. The transfer of products, technology and services across borders is impacted by increased sanctions, trade restrictions or export controls placed on Russia or Ukraine. The restricts access to essential assets or hamper cross-border cooperation in the failure analysis industry. Industries that are directly affected by the conflict, such as electronics, aircraft and defense, could put more money and resources into supply chain vulnerabilities or risk mitigation. The causes changes in the market for failure analysis services, with a greater emphasis on locating and resolving possible weaknesses in vital infrastructure and supply networks.

By Technology

  • Scanning Electron Microscopy (SEM)
  • Transmission Electron Microscopy (TEM)
  • Focused Ion Beam (FIB)
  • Energy-dispersive X-ray spectroscopy (EDS)
  • X-ray Photoelectron Spectroscopy (XPS)
  • Others

By Equipment

  • Electron Microscopes
  • Optical Microscopes
  • X-ray Machines
  • Ion Beam Machines
  • Spectroscopy Equipment
  • Thermal Analyzers
  • Others

By Test

  • Material Testing
  • Non-Destructive Testing (NDT)
  • Chemical Analysis
  • Physical Testing
  • Electrical Testing
  • Mechanical Testing
  • Others

By End-User

  • Semiconductor & Electronics
  • Automotive
  • Aerospace & Defense
  • Medical Devices
  • Material Science
  • Oil & Gas
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • France
    • Italy
    • Spain
    • Rest of Europe
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Asia-Pacific
    • China
    • India
    • Japan
    • Australia
    • Rest of Asia-Pacific
  • Middle East and Africa

Key Developments

  • On November 08, 2022, TESCAN, launched New TENSOR Scanning Transmission Electron Microscope in the market. TENSOR is designed to meet the demands of semiconductor R&D and failure analysis (FA) engineers, materials scientists and crystallographers, as well as anybody interested in multimodal nano-characterization applications (morphological, chemical and structural).
  • On June 06, 2023, LambdaTest launched an AI-powered Test Failure Analysis feature in its smart test orchestration platform HyperExecute. With just one click, digital organizations will be able to expedite their troubleshooting and repair process for test case failures due to this revolutionary new feature.
  • On May 12, 2020, Sauce Labs launched a new machine learning-based analytics solution to improve test quality. Failure Analysis allows developers, testers and QA managers to quickly tackle the most common issues and promote rapid test quality improvement by providing information on how frequently a certain type of failure occurs across a test suite.

Why Purchase the Report?

  • To visualize the global failure analysis market segmentation based on technology, equipment, test, end-user and region, as well as understand key commercial assets and players.
  • Identify commercial opportunities by analyzing trends and co-development.
  • Excel data sheet with numerous data points of failure analysis market-level with all segments.
  • PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
  • Product mapping available as excel consisting of key products of all the major players.

The global failure analysis market report would provide approximately 73 tables, 78 figures and 280 Pages.

Target Audience 2024

  • Manufacturers/ Buyers
  • Industry Investors/Investment Bankers
  • Research Professionals
  • Emerging Companies
Product Code: ICT8301

Table of Contents

Table of Contents

1.Methodology and Scope

  • 1.1.Research Methodology
  • 1.2.Research Objective and Scope of the Report

2.Definition and Overview

3.Executive Summary

  • 3.1.Snippet by Technology
  • 3.2.Snippet by Equipment
  • 3.3.Snippet by Test
  • 3.4.Snippet by End-User
  • 3.5.Snippet by Region

4.Dynamics

  • 4.1.Impacting Factors
    • 4.1.1.Drivers
      • 4.1.1.1.Stringent Regulatory Standards
      • 4.1.1.2.Technological Advancements in Analytical and Imaging
    • 4.1.2.Restraints
      • 4.1.2.1.High Ownership and Maintenance Cost
    • 4.1.3.Opportunity
    • 4.1.4.Impact Analysis

5.Industry Analysis

  • 5.1.Porter's Five Force Analysis
  • 5.2.Supply Chain Analysis
  • 5.3.Pricing Analysis
  • 5.4.Regulatory Analysis
  • 5.5.Russia-Ukraine War Impact Analysis
  • 5.6.DMI Opinion

6.COVID-19 Analysis

  • 6.1.Analysis of COVID-19
    • 6.1.1.Scenario Before COVID
    • 6.1.2.Scenario During COVID
    • 6.1.3.Scenario Post COVID
  • 6.2.Pricing Dynamics Amid COVID-19
  • 6.3.Demand-Supply Spectrum
  • 6.4.Government Initiatives Related to the Market During Pandemic
  • 6.5.Manufacturers Strategic Initiatives
  • 6.6.Conclusion

7.By Technology

  • 7.1.Introduction
    • 7.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
    • 7.1.2.Market Attractiveness Index, By Technology
  • 7.2.Scanning Electron Microscopy (SEM)*
    • 7.2.1.Introduction
    • 7.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 7.3.Transmission Electron Microscopy (TEM)
  • 7.4.Focused Ion Beam (FIB)
  • 7.5.Energy-dispersive X-ray spectroscopy (EDS)
  • 7.6.X-ray Photoelectron Spectroscopy (XPS)
  • 7.7.Others

8.By Equipment

  • 8.1.Introduction
    • 8.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
    • 8.1.2.Market Attractiveness Index, By Equipment
  • 8.2.Electron Microscopes*
    • 8.2.1.Introduction
    • 8.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 8.3.Optical Microscopes
  • 8.4.X-ray Machines
  • 8.5.Ion Beam Machines
  • 8.6.Spectroscopy Equipment
  • 8.7.Thermal Analyzers
  • 8.8.Others

9.By Test

  • 9.1.Introduction
    • 9.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
    • 9.1.2.Market Attractiveness Index, By Test
  • 9.2.Material Testing*
    • 9.2.1.Introduction
    • 9.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 9.3.Non-Destructive Testing (NDT)
  • 9.4.Chemical Analysis
  • 9.5.Physical Testing
  • 9.6.Electrical Testing
  • 9.7.Mechanical Testing
  • 9.8.Others

10.By End-User

  • 10.1.Introduction
    • 10.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 10.1.2.Market Attractiveness Index, By End-User
  • 10.2.Semiconductor & Electronics*
    • 10.2.1.Introduction
    • 10.2.2.Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 10.3.Automotive
  • 10.4.Aerospace & Defense
  • 10.5.Medical Devices
  • 10.6.Material Science
  • 10.7.Oil & Gas
  • 10.8.Others

11.By Region

  • 11.1.Introduction
    • 11.1.1.Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
    • 11.1.2.Market Attractiveness Index, By Region
  • 11.2.North America
    • 11.2.1.Introduction
    • 11.2.2.Key Region-Specific Dynamics
    • 11.2.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
    • 11.2.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
    • 11.2.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
    • 11.2.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 11.2.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 11.2.7.1.U.S.
      • 11.2.7.2.Canada
      • 11.2.7.3.Mexico
  • 11.3.Europe
    • 11.3.1.Introduction
    • 11.3.2.Key Region-Specific Dynamics
    • 11.3.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
    • 11.3.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
    • 11.3.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
    • 11.3.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 11.3.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 11.3.7.1.Germany
      • 11.3.7.2.UK
      • 11.3.7.3.France
      • 11.3.7.4.Italy
      • 11.3.7.5.Spain
      • 11.3.7.6.Rest of Europe
  • 11.4.South America
    • 11.4.1.Introduction
    • 11.4.2.Key Region-Specific Dynamics
    • 11.4.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
    • 11.4.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
    • 11.4.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
    • 11.4.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 11.4.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 11.4.7.1.Brazil
      • 11.4.7.2.Argentina
      • 11.4.7.3.Rest of South America
  • 11.5.Asia-Pacific
    • 11.5.1.Introduction
    • 11.5.2.Key Region-Specific Dynamics
    • 11.5.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
    • 11.5.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
    • 11.5.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
    • 11.5.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 11.5.7.Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 11.5.7.1.China
      • 11.5.7.2.India
      • 11.5.7.3.Japan
      • 11.5.7.4.Australia
      • 11.5.7.5.Rest of Asia-Pacific
  • 11.6.Middle East and Africa
    • 11.6.1.Introduction
    • 11.6.2.Key Region-Specific Dynamics
    • 11.6.3.Market Size Analysis and Y-o-Y Growth Analysis (%), By Technology
    • 11.6.4.Market Size Analysis and Y-o-Y Growth Analysis (%), By Equipment
    • 11.6.5.Market Size Analysis and Y-o-Y Growth Analysis (%), By Test
    • 11.6.6.Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

12.Competitive Landscape

  • 12.1.Competitive Scenario
  • 12.2.Market Positioning/Share Analysis
  • 12.3.Mergers and Acquisitions Analysis

13.Company Profiles

  • 13.1.Keysight Technologies*
    • 13.1.1.Company Overview
    • 13.1.2.Product Portfolio and Description
    • 13.1.3.Financial Overview
    • 13.1.4.Key Developments
  • 13.2.Anritsu Corporation
  • 13.3.TUV SUD
  • 13.4.NEC Corporation
  • 13.5.L3Harris Technologies, Inc.
  • 13.6.Smith's Interconnect
  • 13.7.Intertech Group Plc.
  • 13.8.TEC Materials Testing
  • 13.9.McDowell Owens Engineering Inc.
  • 13.10.Panacea Engineers
  • 13.11.Metallurgical Engineering Services, Inc.

LIST NOT EXHAUSTIVE

14.Appendix

  • 14.1.About Us and Services
  • 14.2.Contact Us
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