PUBLISHER: Bizwit Research & Consulting LLP | PRODUCT CODE: 1569407
PUBLISHER: Bizwit Research & Consulting LLP | PRODUCT CODE: 1569407
Global Wafer Backgrinding Tape Market Size Study, by Type (UV Curable, Non-UV), by Wafer Size (6-Inch, 8-Inch, 12-Inch, Others), and Regional Forecasts 2022-2032
Global Wafer Backgrinding Tape Market is valued at approximately USD 230.06 Million in 2023 and is anticipated to grow with a healthy growth rate of more than 4.5% over the forecast period 2024-2032. Wafer backgrinding is a crucial semiconductor fabrication step, essential for reducing wafer thickness to enable stacking and high-density packaging of integrated circuits. This process involves grinding the backside of the wafer to achieve the desired thickness before assembly, ensuring the device's compactness and performance. The growing demand for wafer fabrication and the increased focus on wafer surface protection during the grinding process are driving the market's growth. Additionally, the expanding semiconductor industry, propelled by the rise in smart technologies and devices, further fuels the demand for wafer backgrinding tapes.
The rise in the need for wafer fabrication is a major driver for growth in the semiconductor and data center markets. As technology advances and demand for electronic devices, from smartphones to high-performance computing systems, increases so does the need for advanced wafer fabrication. Wafer fabrication is crucial for producing the semiconductor chips that power these devices. However, the market faces challenges due to the shift from non-UV to UV curable backgrinding tapes, which tends to increase the overall cost of wafer manufacturing, potentially restraining market growth. Despite these challenges, the market is poised to grow, driven by increasing investments in wafer fabrication equipment and materials, particularly in developing regions such as China, Taiwan, and South Korea, where the semiconductor industry is rapidly advancing.
The key regions considered for the Global Wafer Backgrinding Tape Market study include Asia Pacific, North America, Europe, Latin America, Middle East & Africa, and Rest of the World. Asia Pacific is a dominating region in the Global Wafer Backgrinding Tape Market in terms of revenue. The market growth in the region is being attributed to factors including its extensive semiconductor manufacturing industry and the presence of major players in countries like Japan, South Korea, and China. The region's established electronics sector and high demand for semiconductor devices drive significant consumption of backgrinding tape, which is essential for wafer thinning processes. Whereas, the market in North America is anticipated to grow at the fastest rate over the forecast period fueled by advancements in technology and increasing investments in semiconductor research and development. The U.S. is leading this growth, supported by a surge in demand for high-performance computing and electronics, which in turn boosts the need for efficient wafer backgrinding solutions.
Major market player included in this report are:
- AI Technology Inc.
- Furukawa Electric Co. Ltd.
- AMC Co. Ltd.
- Denka Company Limited
- Pantech Tape Co. Ltd.
- Force-One Applied Materials
- Minitron Elektronik GmbH
- Nitto Denko Corporation
- Mitsui Chemicals Inc.
- Lintec of America Inc. (Lintec Corporation)
- Sumitomo Bakelite
- Ultron Systems
- Nippon Pulse Motor
- Loadpoint Limited
- NEPTCO
The detailed segments and sub-segment of the market are explained below:
By Type
- UV Curable
- Non-UV
By Wafer Size
- 6-Inch
- 8-Inch
- 12-Inch
- Others
By Region:
- North America
- U.S.
- Canada
- Europe
- UK
- Germany
- France
- Spain
- Italy
- ROE
- Asia Pacific
- China
- India
- Japan
- Australia
- South Korea
- RoAPAC
- Latin America
- Brazil
- Mexico
- Rest of Latin America
- Middle East & Africa
- Saudi Arabia
- South Africa
- RoMEA
Years considered for the study are as follows:
- Historical year - 2022
- Base year - 2023
- Forecast period - 2024 to 2032
Key Takeaways:
- Market Estimates & Forecast for 10 years from 2022 to 2032.
- Annualized revenues and regional level analysis for each market segment.
- Detailed analysis of geographical landscape with Country level analysis of major regions.
- Competitive landscape with information on major players in the market.
- Analysis of key business strategies and recommendations on future market approach.
- Analysis of competitive structure of the market.
- Demand side and supply side analysis of the market.
Table of Contents
Chapter 1. Global Wafer Backgrinding Tape Market Executive Summary
- 1.1. Global Wafer Backgrinding Tape Market Size & Forecast (2022- 2032)
- 1.2. Regional Summary
- 1.3. Segmental Summary
- 1.3.1. By Type
- 1.3.2. By Wafer Size
- 1.4. Key Trends
- 1.5. Recession Impact
- 1.6. Analyst Recommendation & Conclusion
Chapter 2. Global Wafer Backgrinding Tape Market Definition and Research Assumptions
- 2.1. Research Objective
- 2.2. Market Definition
- 2.3. Research Assumptions
- 2.3.1. Inclusion & Exclusion
- 2.3.2. Limitations
- 2.3.3. Supply Side Analysis
- 2.3.3.1. Availability
- 2.3.3.2. Infrastructure
- 2.3.3.3. Regulatory Environment
- 2.3.3.4. Market Competition
- 2.3.3.5. Economic Viability (Consumer's Perspective)
- 2.3.4. Demand Side Analysis
- 2.3.4.1. Regulatory frameworks
- 2.3.4.2. Technological Advancements
- 2.3.4.3. Environmental Considerations
- 2.3.4.4. Consumer Awareness & Acceptance
- 2.4. Estimation Methodology
- 2.5. Years Considered for the Study
- 2.6. Currency Conversion Rates
Chapter 3. Global Wafer Backgrinding Tape Market Dynamics
- 3.1. Market Drivers
- 3.1.1. Rise in need for wafer fabrication
- 3.1.2. Increase in focus on wafer surface protection during grinding process
- 3.1.3. Growth in the semiconductor industry
- 3.2. Market Challenges
- 3.2.1. Increase in shift from non-UV to UV curable backgrinding tapes
- 3.2.2. High operational costs associated with wafer manufacturing
- 3.3. Market Opportunities
- 3.3.1. Increase in investment in wafer fabrication equipment and materials
- 3.3.2. Growing opportunities in emerging countries like India and the Philippines
Chapter 4. Global Wafer Backgrinding Tape Market Industry Analysis
- 4.1. Porter's 5 Force Model
- 4.1.1. Bargaining Power of Suppliers
- 4.1.2. Bargaining Power of Buyers
- 4.1.3. Threat of New Entrants
- 4.1.4. Threat of Substitutes
- 4.1.5. Competitive Rivalry
- 4.1.6. Futuristic Approach to Porter's 5 Force Model
- 4.1.7. Porter's 5 Force Impact Analysis
- 4.2. PESTEL Analysis
- 4.2.1. Political
- 4.2.2. Economical
- 4.2.3. Social
- 4.2.4. Technological
- 4.2.5. Environmental
- 4.2.6. Legal
- 4.3. Top investment opportunity
- 4.4. Top winning strategies
- 4.5. Disruptive Trends
- 4.6. Industry Expert Perspective
- 4.7. Analyst Recommendation & Conclusion
Chapter 5. Global Wafer Backgrinding Tape Market Size & Forecasts by Type 2022-2032
- 5.1. Segment Dashboard
- 5.2. Global Wafer Backgrinding Tape Market: Type Revenue Trend Analysis, 2022 & 2032 (USD Million)
- 5.2.1. UV Curable
- 5.2.2. Non-UV
Chapter 6. Global Wafer Backgrinding Tape Market Size & Forecasts by Wafer Size 2022-2032
- 6.1. Segment Dashboard
- 6.2. Global Wafer Backgrinding Tape Market: Wafer Size Revenue Trend Analysis, 2022 & 2032 (USD Million)
- 6.2.1. 6-Inch
- 6.2.2. 8-Inch
- 6.2.3. 12-Inch
- 6.2.4. Others
Chapter 7. Global Wafer Backgrinding Tape Market Size & Forecasts by Region 2022-2032
- 7.1. North America Wafer Backgrinding Tape Market
- 7.1.1. U.S. Wafer Backgrinding Tape Market
- 7.1.1.1. Type breakdown size & forecasts, 2022-2032
- 7.1.1.2. Wafer Size breakdown size & forecasts, 2022-2032
- 7.1.2. Canada Wafer Backgrinding Tape Market
- 7.1.1. U.S. Wafer Backgrinding Tape Market
- 7.2. Europe Wafer Backgrinding Tape Market
- 7.2.1. U.K. Wafer Backgrinding Tape Market
- 7.2.2. Germany Wafer Backgrinding Tape Market
- 7.2.3. France Wafer Backgrinding Tape Market
- 7.2.4. Spain Wafer Backgrinding Tape Market
- 7.2.5. Italy Wafer Backgrinding Tape Market
- 7.2.6. Rest of Europe Wafer Backgrinding Tape Market
- 7.3. Asia-Pacific Wafer Backgrinding Tape Market
- 7.3.1. China Wafer Backgrinding Tape Market
- 7.3.2. India Wafer Backgrinding Tape Market
- 7.3.3. Japan Wafer Backgrinding Tape Market
- 7.3.4. Australia Wafer Backgrinding Tape Market
- 7.3.5. South Korea Wafer Backgrinding Tape Market
- 7.3.6. Rest of Asia Pacific Wafer Backgrinding Tape Market
- 7.4. Latin America Wafer Backgrinding Tape Market
- 7.4.1. Brazil Wafer Backgrinding Tape Market
- 7.4.2. Mexico Wafer Backgrinding Tape Market
- 7.4.3. Rest of Latin America Wafer Backgrinding Tape Market
- 7.5. Middle East & Africa Wafer Backgrinding Tape Market
- 7.5.1. Saudi Arabia Wafer Backgrinding Tape Market
- 7.5.2. South Africa Wafer Backgrinding Tape Market
- 7.5.3. Rest of Middle East & Africa Wafer Backgrinding Tape Market
Chapter 8. Competitive Intelligence
- 8.1. Key Company SWOT Analysis
- 8.2. Top Market Strategies
- 8.3. Company Profiles
- 8.3.1. AI Technology Inc.
- 8.3.1.1. Key Information
- 8.3.1.2. Overview
- 8.3.1.3. Financial (Subject to Data Availability)
- 8.3.1.4. Product Summary
- 8.3.1.5. Market Strategies
- 8.3.2. Furukawa Electric Co. Ltd.
- 8.3.3. AMC Co. Ltd.
- 8.3.4. Denka Company Limited
- 8.3.5. Pantech Tape Co. Ltd.
- 8.3.6. Force-One Applied Materials
- 8.3.7. Minitron Elektronik GmbH
- 8.3.8. Nitto Denko Corporation
- 8.3.9. Mitsui Chemicals Inc.
- 8.3.10. Lintec of America Inc. (Lintec Corporation)
- 8.3.11. Sumitomo Bakelite
- 8.3.12. Ultron Systems
- 8.3.13. Nippon Pulse Motor
- 8.3.14. Loadpoint Limited
- 8.3.15. NEPTCO
- 8.3.1. AI Technology Inc.
Chapter 9. Research Process
- 9.1. Research Process
- 9.1.1. Data Mining
- 9.1.2. Analysis
- 9.1.3. Market Estimation
- 9.1.4. Validation
- 9.1.5. Publishing
- 9.2. Research Attributes
