Global Multilayer Printed Circuit Board Market Size study, by Layer, by Substrate, by End Use Industry and Regional Forecasts 2022-2032

Description

The Global Multilayer Printed Circuit Board (PCB) Market was valued at approximately USD 88.1 billion in 2023 and is expected to witness robust growth, reaching nearly USD 145.09 billion by 2032, with a compound annual growth rate (CAGR) of 5.7% from 2024 to 2032. Multilayer PCBs are integral components in the realm of modern electronics, providing compact, high-density circuit solutions that enhance the performance and functionality of a wide range of devices. These circuit boards consist of multiple conductive layers stacked and insulated to support complex electronic configurations, making them essential in advanced electronic devices across various industries.

The rapid technological advancements in consumer electronics, such as smartphones, tablets, and wearables, significantly contribute to the increasing demand for multilayer PCBs. These devices require sophisticated circuit designs to maintain their compactness and high performance, which multilayer PCBs effectively provide. Additionally, the automotive industry's transformation, driven by the electrification of vehicles, autonomous driving, and advanced driver-assistance systems (ADAS), further fuels the market. The growing complexity of automotive electronics necessitates the use of reliable, high-density multilayer PCBs, making them indispensable in this sector. Furthermore, the global expansion of 5G technology serves as a substantial driver for the multilayer PCB market. The deployment of 5G networks demands advanced communication systems capable of high-speed data processing and transmission, which are supported by multilayer PCBs. The development of robust infrastructure, including base stations and networking equipment, is crucial for the successful rollout of 5G, thereby increasing the demand for these advanced circuit boards.

The key regions considered for the Global Multilayer Printed Circuit Board Market study include Asia Pacific, North America, Europe, Latin America, and Rest of the World. The market is expected to witness significant growth in Asia-Pacific due to the presence of key electronics manufacturers, rapid industrialization, and increasing investments in 5G technology. North America and Europe are also anticipated to contribute substantially to market growth, driven by the adoption of advanced technologies in automotive and healthcare sectors.

Major market players included in this report are:

Compeq Manufacturing Co., Ltd.
Sumitomo Electric Industries, Ltd.
Nippon Mektron, Ltd.
Amphenol ZD Tech
TE Connectivity Ltd.
Hon Hai Precision Industry Co., Ltd.
AT&S Austria Technologie & Systemtechnik AG
Molex
TTM Technologies, Inc.
Unimicron Technology Corporation

The detailed segments and sub-segment of the market are explained below:

By Layer:

Layer 4-6
Layer 6+

By Substrate:

Rigid
Flexible
Rigid-Flex

By End Use Industry:

Industrial Electronics
Healthcare
Aerospace & Defense
Automotive
IT & Telecom
Consumer Electronics
Others

By Region:

North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
RoLA
Middle East & Africa
Saudi Arabia
South Africa
RoMEA

Years considered for the study are as follows:

Historical year - 2022
Base year - 2023
Forecast period - 2024 to 2032

Key Takeaways:

Market Estimates & Forecast for 10 years from 2022 to 2032.
Annualized revenues and regional level analysis for each market segment.
Detailed analysis of geographical landscape with Country level analysis of major regions.
Competitive landscape with information on major players in the market.
Analysis of key business strategies and recommendations on future market approach.
Analysis of competitive structure of the market.
Demand side and supply side analysis of the market

Chapter 1. Global Multilayer Printed Circuit Board Market Executive Summary

1.1. Global Multilayer Printed Circuit Board Market Size & Forecast (2022-2032)
1.2. Regional Summary
1.3. Segmental Summary
- 1.3.1. By Layer
- 1.3.2. By Substrate
- 1.3.3. By End Use Industry
1.4. Key Trends
1.5. Recession Impact
1.6. Analyst Recommendation & Conclusion

Chapter 2. Global Multilayer Printed Circuit Board Market Definition and Research Assumptions

2.1. Research Objective
2.2. Market Definition
2.3. Research Assumptions
- 2.3.1. Inclusion & Exclusion
- 2.3.2. Limitations
- 2.3.3. Supply Side Analysis
  - 2.3.3.1. Availability
  - 2.3.3.2. Infrastructure
  - 2.3.3.3. Regulatory Environment
  - 2.3.3.4. Market Competition
  - 2.3.3.5. Economic Viability (Consumer's Perspective)
- 2.3.4. Demand Side Analysis
  - 2.3.4.1. Regulatory frameworks
  - 2.3.4.2. Technological Advancements
  - 2.3.4.3. Environmental Considerations
  - 2.3.4.4. Consumer Awareness & Acceptance
2.4. Estimation Methodology
2.5. Years Considered for the Study
2.6. Currency Conversion Rates

Chapter 3. Global Multilayer Printed Circuit Board Market Dynamics

3.1. Market Drivers
- 3.1.1. Technological Advancements in Consumer Electronics
- 3.1.2. Growing Automotive Industry and Electrification
- 3.1.3. Expansion of 5G Technology
3.2. Market Challenges
- 3.2.1. High Manufacturing Costs
3.3. Market Opportunities
- 3.3.1. Rising Demand in Healthcare Devices
- 3.3.2. Expansion of IoT Applications

Chapter 4. Global Multilayer Printed Circuit Board Market Industry Analysis

4.1. Porter's 5 Force Model
- 4.1.1. Bargaining Power of Suppliers
- 4.1.2. Bargaining Power of Buyers
- 4.1.3. Threat of New Entrants
- 4.1.4. Threat of Substitutes
- 4.1.5. Competitive Rivalry
- 4.1.6. Futuristic Approach to Porter's 5 Force Model
- 4.1.7. Porter's 5 Force Impact Analysis
4.2. PESTEL Analysis
- 4.2.1. Political
- 4.2.2. Economical
- 4.2.3. Social
- 4.2.4. Technological
- 4.2.5. Environmental
- 4.2.6. Legal
4.3. Top investment opportunity
4.4. Top winning strategies
4.5. Disruptive Trends
4.6. Industry Expert Perspective
4.7. Analyst Recommendation & Conclusion

Chapter 5. Global Multilayer Printed Circuit Board Market Size & Forecasts by Layer 2022-2032

5.1. Segment Dashboard
5.2. Global Multilayer Printed Circuit Board Market: Layer Revenue Trend Analysis, 2022 & 2032 (USD Billion)
- 5.2.1. Layer 4-6
- 5.2.2. Layer 6+

Chapter 6. Global Multilayer Printed Circuit Board Market Size & Forecasts by Substrate 2022-2032

6.1. Segment Dashboard
6.2. Global Multilayer Printed Circuit Board Market: Substrate Revenue Trend Analysis, 2022 & 2032 (USD Billion)
- 6.2.1. Rigid
- 6.2.2. Flexible
- 6.2.3. Rigid-Flex

Chapter 7. Global Multilayer Printed Circuit Board Market Size & Forecasts by End Use Industry 2022-2032

7.1. Segment Dashboard
7.2. Global Multilayer Printed Circuit Board Market: End Use Industry Revenue Trend Analysis, 2022 & 2032 (USD Billion)
- 7.2.1. Industrial Electronics
- 7.2.2. Healthcare
- 7.2.3. Aerospace & Defense
- 7.2.4. Automotive
- 7.2.5. IT & Telecom
- 7.2.6. Consumer Electronics
- 7.2.7. Others

Chapter 8. Global Multilayer Printed Circuit Board Market Size & Forecasts by Region 2022-2032

8.1. North America Multilayer Printed Circuit Board Market
- 8.1.1. U.S. Multilayer Printed Circuit Board Market
  - 8.1.1.1. Layer breakdown size & forecasts, 2022-2032
  - 8.1.1.2. Substrate breakdown size & forecasts, 2022-2032
  - 8.1.1.3. End Use Industry breakdown size & forecasts, 2022-2032
- 8.1.2. Canada Multilayer Printed Circuit Board Market
  - 8.1.2.1. Layer breakdown size & forecasts, 2022-2032
  - 8.1.2.2. Substrate breakdown size & forecasts, 2022-2032
  - 8.1.2.3. End Use Industry breakdown size & forecasts, 2022-2032
8.2. Europe Multilayer Printed Circuit Board Market
- 8.2.1. U.K. Multilayer Printed Circuit Board Market
- 8.2.2. Germany Multilayer Printed Circuit Board Market
- 8.2.3. France Multilayer Printed Circuit Board Market
- 8.2.4. Spain Multilayer Printed Circuit Board Market
- 8.2.5. Italy Multilayer Printed Circuit Board Market
- 8.2.6. Rest of Europe Multilayer Printed Circuit Board Market
8.3. Asia-Pacific Multilayer Printed Circuit Board Market
- 8.3.1. China Multilayer Printed Circuit Board Market
- 8.3.2. India Multilayer Printed Circuit Board Market
- 8.3.3. Japan Multilayer Printed Circuit Board Market
- 8.3.4. Australia Multilayer Printed Circuit Board Market
- 8.3.5. South Korea Multilayer Printed Circuit Board Market
- 8.3.6. Rest of Asia Pacific Multilayer Printed Circuit Board Market
8.4. Latin America Multilayer Printed Circuit Board Market
- 8.4.1. Brazil Multilayer Printed Circuit Board Market
- 8.4.2. Mexico Multilayer Printed Circuit Board Market
- 8.4.3. Rest of Latin America Multilayer Printed Circuit Board Market
8.5. Middle East & Africa Multilayer Printed Circuit Board Market
- 8.5.1. Saudi Arabia Multilayer Printed Circuit Board Market
- 8.5.2. South Africa Multilayer Printed Circuit Board Market
- 8.5.3. Rest of Middle East & Africa Multilayer Printed Circuit Board Market

Chapter 9. Competitive Intelligence

9.1. Key Company SWOT Analysis
9.2. Top Market Strategies
9.3. Company Profiles
- 9.3.1. Compeq Manufacturing Co., Ltd.
  - 9.3.1.1. Key Information
  - 9.3.1.2. Overview
  - 9.3.1.3. Financial (Subject to Data Availability)
  - 9.3.1.4. Product Summary
  - 9.3.1.5. Market Strategies
- 9.3.2. Sumitomo Electric Industries, Ltd.
- 9.3.3. Nippon Mektron, Ltd.
- 9.3.4. Amphenol ZD Tech
- 9.3.5. TE Connectivity Ltd.
- 9.3.6. Hon Hai Precision Industry Co., Ltd.
- 9.3.7. AT&S Austria Technologie & Systemtechnik AG
- 9.3.8. Molex
- 9.3.9. TTM Technologies, Inc.
- 9.3.10. Unimicron Technology Corporation

Chapter 10. Research Process

10.1. Research Process
- 10.1.1. Data Mining
- 10.1.2. Analysis
- 10.1.3. Market Estimation
- 10.1.4. Validation
- 10.1.5. Publishing
10.2. Research Attributes