PUBLISHER: Bizwit Research & Consulting LLP | PRODUCT CODE: 1462851
PUBLISHER: Bizwit Research & Consulting LLP | PRODUCT CODE: 1462851
Global Semiconductor Bonding Market is valued approximately at USD 0.91 billion in 2022 and is anticipated to grow with a healthy growth rate of more than 3.60% over the forecast period 2023-2030. Semiconductor bonding is the process of joining two semiconductor materials to create a functional device or structure. This bonding can be achieved through various techniques, and the choice of method depends on the specific application and the properties of the materials involved. Moreover, the rising demand for miniature electronic components, rising adoption of MEMS and sSensors, growing demand for electric and hybrid vehicles that are anticipated to create the lucrative demand for the market during forecast period 2023-2030.
Additionally, the growing demand for electric and hybrid vehicles is a significant factor contributing to the growth of the Semiconductor Bonding Market. The Electric vehicles (EVs) and hybrid electric vehicles (HEVs) rely heavily on power electronics for functions such as motor control, battery management, and power conversion. Semiconductor devices like such as insulated gate bipolar transistors (IGBTs) and power modules play a crucial role in these applications. According to The International Energy Agency, in 2019, the number of Battery Electric Vehicles (BEV) and Plug-in Hybrid Vehicles (PHEV) sold was 580,000 and 1,500,000, respectively. In 2022, the numbers reached 2,900,000 and 7,300,000, respectively. As a result, the growing demand for EVs is anticipated to propel lucrative demand for the market. Moreover, the growing adoption of IoT and AI in automotive sector, and increased connectivity and 5G adoption is anticipated to create the lucrative opportunity for the market growth. However, the high cost associated with semiconductor bonding solution stifles market growth throughout the forecast period of 2023-2030.
The key regions considered for the Global Semiconductor Bonding Market study includes Asia Pacific, North America, Europe, Latin America, and Middle East & Africa. North America dominated the market in 2022 with largest market share owing to the increasing demand for electronic devices, growing technological advancements and innovations in semiconductor manufacturing, and rise in artificial intelligence (AI) and data centers. Whereas, the Asia Pacific region is expected to grow with the fastest growth rate during the forecast period, owing to factors such as the rising demand for electronic devices, growing expansion of semiconductor industry, increased investments in research and development, and growing adoption of internet of things (IoT).
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.
The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
List of tables and figures and dummy in nature, final lists may vary in the final deliverable
List of tables and figures and dummy in nature, final lists may vary in the final deliverable