PUBLISHER: Aranca | PRODUCT CODE: 1459585
PUBLISHER: Aranca | PRODUCT CODE: 1459585
Global Dicing Tape Materials Market 2024
The Dicing tape market is poised for remarkable growth, projected to reach approximately USD 2 billion by 2030, with a compelling CAGR of approximately 6% from a value of USD 1 billion in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for dicing tape.
This report provides a deep-dive into the following points in this detailed assessment of the Dicing tape materials market:
Product Overview
Defining the functions of the Dicing tape:
- UV Curable Dicing Tape
- Non-UV Curable Dicing Tape, etc.
Global Dicing Tape Market overview
Insight on current (2022) and forecasted (2030) global market for dicing tape materials including an analysis of the key trends and drivers impacting market growth and choice of materials.
Global market segmentation by material type
Global market segmentation by key dicing tape – UV Curable Dicing Tape, Non-UV Curable Dicing Tape, etc
Key Selection criteria or Performance Parameters for material selection including the voice of the customer on parameters such as Release Properties, Adhesion Strength, Uniformity, and Consistency
Competition overview:
Key competitor profiles and analyzing the competitor landscape of major companies including Nitto Denko, LINTEC, Furukawa Electric, Denka, Sumitomo Bakelite, etc.
Patent overview:
Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration and the associated applications.
Market Outlook
Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.
Table of Contents
1. Introduction
- 1.1 Report Overview
- 1.2 Product Focus
- 1.3 Methodology
2. Process Overview
- 2.1 Thin Film Molding
- 2.2 Photolithography
- 2.3 Etching
- 2.4 Doping
- 2.5 CMP
- 2.6 Dicing
- 2.7 Wire Bonding
- 2.8 Packaging
3. Value Chain Overview
4. Market Overview
5. Detailed Market Assessment
- 5.1 Dicing Tape
5. Patent Overview
6. Market Outlook
7. Annexure
List of Tables
- Table 4.1: Global Semiconductor Materials Market - By Material Type
- Table 4.2: Global Semiconductor Materials Market - Key Competitors
- Table 5.1.1: Global Dicing Tape Materials Market - By Material Type
- Table 5.1.2: Manufacturers v/s Component and Material Used - Dicing Tape
- Table 6.1: Patent Publications by Geography - Dicing Tape
- Table 6.2: Patent Listing - Dicing Tape
List of Figures
- Chart 4.1: Global Semiconductor Materials Market
- Chart 4.2: Global Semiconductor Materials Market - By Material Type
- Chart 4.3: Global Semiconductor Materials Market - By Component
- Chart 5.1.1: Global Dicing Tape Materials Market
- Chart 5.1.2: Global Dicing Tape Materials Market, By Material
- Chart 6.1: Patent Publication Trend - Dicing Tape
