PUBLISHER: Aranca | PRODUCT CODE: 1459576
PUBLISHER: Aranca | PRODUCT CODE: 1459576
Global Wafer Carrier Materials Market 2024
The Wafer Carrying Component materials market is poised for remarkable growth, projected to surpass USD 800 million by 2030, with a CAGR of approximately 6% from a value of USD 500 million in 2022. The continuous progress of semiconductor technology, the increase in consumer electronics usage, and the ongoing trend of electronics miniaturization are all contributing to the demand for wafer-carrying components.
This report provides a deep-dive into the following points in this detailed assessment of the wafer-carrying component materials market
Product Overview
Defining the functions and the key materials used for major wafer-carrying components
- Wafers Pod
- Wafers Cassette
- Wafers Boat, etc.
Global Wafer Carrying Component Materials Market Overview
Insight into the current (2022) and forecasted (2030) global market for Wafer Carrying Component Materials including an analysis of the key trends and drivers impacting market growth and choice of materials.
Global market segmentation by material type
Global market segmentation by key materials used – Polymers, Metals, Ceramics, Composites, etc.
Key Selection criteria or Performance Parameters for material selection including voice of customer on parameters such as chemical inertness, stiffness, conductivity, etc.
Competition overview:
Key competitor profiles and analyzing the competitor landscape of 15+ companies including Entegris, Epak, Shin Etsu, Miraial, Gudeng Precision Industrial, etc.
Patent overview:
Analyzing key patent families by major assignees in the last 4-5 years. The report also includes insights on the research focus of the patents, materials under consideration, and the associated applications.
Market Outlook:
Backed by extensive secondary research and validation through primary research, this report also presents a reliable view of the market outlook and factors influencing the same.
Table of Contents
1. Introduction
- 1.1 Report Overview
- 1.2 Product Focus
- 1.3 Methodology
2. Process Overview
- 2.1 Thin Film Molding
- 2.2 Photolithography
- 2.3 Etching
- 2.4 Doping
- 2.5 CMP
- 2.6 Dicing
- 2.7 Wire Bonding
- 2.8 Packaging
3. Value Chain Overview
4. Market Overview
5. Detailed Market Assessment
- 5.1 Wafer Carrier
5. Patent Overview
6. Market Outlook
7. Annexure
List of Tables
- Table 4.1: Global Semiconductor Materials Market - By Material Type
- Table 4.2: Global Semiconductor Materials Market - Key Competitors
- Table 5.1.1: Global Wafer Carrier Materials Market - By Material Type
- Table 5.1.2: Manufacturers v/s Component and Material Used - Wafer Carrier
- Table 6.1: Patent Publications by Geography - Wafer Carrier
- Table 6.2: Patent Listing - Wafer Carrier
List of Figures
- Chart 4.1: Global Semiconductor Materials Market
- Chart 4.2: Global Semiconductor Materials Market - By Material Type
- Chart 4.3: Global Semiconductor Materials Market - By Component
- Chart 5.1.1: Global Wafer Carrier Materials Market
- Chart 5.1.2: Global Wafer Carrier Materials Market, By Material
- Chart 6.1: Patent Publication Trend - Wafer Carrier
