PUBLISHER: AnalystView Market Insights | PRODUCT CODE: 1629335
PUBLISHER: AnalystView Market Insights | PRODUCT CODE: 1629335
The Semiconductor Dry Etch Systems Market was valued at USD 16,251.6 million in 2023 and expanded at a CAGR of 6.20% from 2024 to 2032.
A semiconductor dry etch system is an important piece of equipment used in the production of semiconductor devices. It uses dry etching techniques to selectively remove material from a semiconductor wafer's surface, resulting in the detailed patterns required for integrated circuits and microelectronic devices.
Semiconductor Dry Etch Systems Market- Market Dynamics
Increasing Government Investment in Semiconductor Manufacturing
Governments and the commercial sector around the world are recognising the strategic relevance of semiconductors, resulting in significant financial commitments to improve production capacity. According to the India Brand Equity Foundation, India launched the Semicon India Program in December 2021, with an initial allocation of approximately USD 9.2 billion to enhance its semiconductor and display manufacturing ecosystems. In the interim Union Budget for 2024, this allocation was increased to around USD 833.7 million, reflecting continued support for the industry. The Modified Program for Development of Semiconductors and Display Manufacturing Ecosystem in India is expected to cost approximately USD 181.5 million in FY24, according to revised projections. Such expenditures are intended to enhance local production, expedite technical breakthroughs, and entice global businesses to establish industrial sites throughout the country.
Semiconductor Dry Etch Systems Market- Key Insights
Our research analyst estimates that the global market will develop at a CAGR of approximately 6.20% from 2024 to 2032.
The Deep Reactive Ion Etching (DRIE) etching technology category is predicted to expand at a substantial revenue CAGR, according to Etching Technique segmentation.
In 2023, logic and memory applications dominated the market based on application segmentation.
On the basis of region, North America was the leading revenue generator in 2023
The Global Semiconductor Dry Etch Systems Market is segmented on the basis of Etching Technique, Application, End-use, and Region.
The market is divided into three categories based on the Etching Technique: Inductively Coupled Plasma (ICP) Etching, Reactive Ion Etching (RIE), and Deep Reactive Ion Etching (DRIE). The Deep Reactive Ion Etching (DRIE) etching technology category is predicted to expand at a substantial CAGR in terms of revenue between 2024 and 2032. Reactive Ion Etching (RIE) is a versatile and frequently used etching process in the semiconductor industry that uses chemically reactive plasma to remove specific materials from substrate surfaces. RIE is well-known for its ability to create anisotropic etch profiles, which are required for producing well-defined, high-resolution patterns. The demand for RIE technology stems from its crucial role in the manufacture of electronic components like as integrated circuits (ICs) and microelectronic devices, where precise pattern transfer and material shaping are essential. Its ability to etch a wide range of materials while maintaining control over the etch rate and profile makes it important in the manufacturing of semiconductors and nanotech devices.
The market is divided into three categories based on Application: Logic and Memory, Power Devices, and MEMS and Sensors. The logic and memory applications segment dominated the market in 2023. Semiconductor dry etch systems are critical for producing modern logic circuits, which serve as the brains of computers, smartphones, and a wide range of other digital devices. Etching allows the development of detailed patterns on silicon wafers, which define the small transistors and circuits that process information. As the demand for faster, more efficient computing develops, the precision and capability of dry etch technologies improve, allowing for the reduction of chip features while increasing speed and usefulness.
Semiconductor Dry Etch Systems Market- Geographical Insights
Geographically, this market is distributed over Asia Pacific, North America, Latin America, the Middle East, and Africa, Europe. These regions are further split based on the nations bringing commerce. North America, particularly the United States, is a major market for semiconductor dry etch systems, owing to its robust R&D ecosystem and the presence of large semiconductor companies. The region's emphasis on cutting-edge technologies, including artificial intelligence (AI), 5G, and quantum computing, necessitates the utilisation of advanced semiconductor manufacturing procedures such as dry etching. Furthermore, measures to boost domestic semiconductor manufacturing capacity and reduce reliance on foreign supply chains have resulted in increased investment in semiconductor production facilities, driving rising demand for high-precision dry etch systems.
The Asia Pacific semiconductor dry etch systems market had the greatest CAGR in 2023. Countries such as Taiwan, South Korea, and Japan, excluding China, play a significant role in the market for semiconductor dry etch systems. This region is home to some of the world's major semiconductor manufacturers, who are constantly increasing their production capacity and investing in cutting-edge manufacturing technology to stay competitive in the worldwide market. The push for smaller, more efficient semiconductor devices, together with the rise of semiconductor applications in the automotive and industrial sectors, is driving the demand for sophisticated dry etch systems in these countries.
The semiconductor dry etch systems competitive landscape is highly competitive among the leading manufacturers. The major players in the market for semiconductor dry etch systems are H-Square Corporation, KLA Corporation, Ted Pella, Inc., and Shin-Etsu Chemical Co., Ltd., among others, emphasising technological innovation and product innovation to ensure performance and efficiency. Companies are investing in R&D towards etch processes that enhance precision and diminish defects, all of which are major requirements to meet the extremely rigorous demands of semiconductor fabrication. There are so many strategic alliances and collaborations as firms seek each other's complementary strengths and widen their market reach. Improved demand for smaller, more power-intensive semiconductor devices makes companies also look at improving what they are offering. With the arrival of new players and the latest etching technologies, the competitive environment here is tough. It needs to be negotiated on a daily basis by existing firms in order to maintain the market position.
In March 2022, Tokyo Electron (TEL) unveiled its newest plasma etch systems, the Impressio 1800 PICP Pro and Betelex 1800 PICP Pro. These systems are outfitted with the revolutionary PICP Pro chamber, which is intended for high-resolution processing of 6th-generation (G6: 1,500 mm x 1,850 mm) glass substrates.