PUBLISHER: AnalystView Market Insights | PRODUCT CODE: 1629285
PUBLISHER: AnalystView Market Insights | PRODUCT CODE: 1629285
The Semiconductor Wafer Polishing and Grinding Equipment Market was valued at USD 409.6 million in 2023 and expanded at a CAGR of 4.20% from 2024 to 2032.
Semiconductor wafer polishing and grinding equipment are used during the semiconductor wafer manufacturing process to obtain the needed surface flatness and smoothness. This equipment removes defects and prepares wafers for subsequent processing and manufacture of semiconductor devices.
Semiconductor Wafer Polishing and Grinding Equipment Market- Market Dynamics
Increasing demand for consumer electronics
Increased demand for consumer electronics is driving the growth of the Semiconductor Wafer Polishing and Grinding Equipment Market. As the popularity of smartphones, tablets, and smart home gadgets grows, so does the demand for innovative semiconductors that power this technology. These semiconductors are made on silicon wafers, which require precision polishing and grinding to assure peak performance and purity. The push for smaller, quicker, and more energy-efficient devices necessitates increasingly complex and high-quality semiconductor production processes, resulting in increased investment in advanced polishing and grinding equipment. Furthermore, upcoming technologies like as 5G and IoT drive up demand.
Semiconductor Wafer Polishing and Grinding Equipment Market- Key Insights
As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 4.20% over the forecast period (2024-2032)
Based on Application segmentation, the 300 mm segment currently dominates the Semiconductor Wafer Polishing and Grinding Equipment Market.
Based on End-user segmentation, The memory manufacturers' market is predicted to increase substantially.
In terms of region, North America was the largest revenue generator in 2023.
The Global Semiconductor Wafer Polishing and Grinding Equipment Market is segmented on the basis of Application, End-user, and Region.
The market is segmented into three segments according to application: 200 mm, 300 mm, and Less than 200 mm. The 300 mm segment currently dominates the Semiconductor Wafer Polishing and Grinding Equipment Market mainly because of the demand for wafers in higher thicknesses, as larger-sized wafers ensure improved yields and efficiency in production processes. The 300 mm is widely used in more applications, such as microprocessors, memory chips, etc. Hence, it is a highly in-demand industry.
The market is divided into three categories based on End-user: IDM, Foundries, and Memory manufacturers. The memory manufacturers market is expected to grow rapidly over the assessment period, driven by rising demand for bigger memory capacity and quicker data processing rates in a wide range of applications, from consumer electronics to enterprise-level data centres. Memory chips, such as DRAM and NAND flash, are essential for improving the performance and operation of different electronic devices. To achieve maximum yield and performance, these memory components must be manufactured using very precise and dependable wafer polishing and grinding techniques. Global data consumption and generation continue to rise, fueled by trends such as cloud computing, big data, and the proliferation of connected devices, and the demand for memory chips is expected to rise, necessitating the use of specialised equipment to enable their manufacturing.
Semiconductor Wafer Polishing and Grinding Equipment Market- Geographical Insights
Geographically, this market is distributed over North America, Latin America, Europe, Asia Pacific, and the Middle East and Africa. These regions are further split based on the nations bringing commerce. North America currently dominates the market, owing to the presence of significant industry players in the area. Furthermore, rising demand for power semiconductor integrated circuits in automotive applications, as well as major investments in electric infrastructure, are likely to fuel market expansion in North America throughout the forecast period.
Asia-Pacific is predicted to develop significantly in the market. The rising number of applications for various equipment kinds drives this growth. Furthermore, increasing consolidation in the fabless semiconductor industry is expected to drive market growth in the future years as companies seek more efficient and innovative manufacturing techniques.
The Semiconductor Wafer Polishing and Grinding Equipment market is highly competitive, with a number of key players dominating the industry. Major players include ALLIED HIGH TECH PRODUCTS, INC, Applied Materials Inc., ASM International NV, and Axus Technology, which focus on process control and yield management in semiconductor fabrication. Other companies like DISCO Corporation and Struers A/S also offer specialised equipment for precision grinding and polishing. The requirements of higher performance semiconductors in various applications - such as consumer electronics and automotive technologies - drive the competition among the players listed above.
In March 2023, DISCO Corporation, a supplier of semiconductor production equipment, invented a completely automated dicing saw that supports 8-inch wafers, which is now available on the market.