PUBLISHER: AnalystView Market Insights | PRODUCT CODE: 1532807
PUBLISHER: AnalystView Market Insights | PRODUCT CODE: 1532807
Non-Conductive Film for Semiconductor (HBM) Market size was valued at USD 6.89 Million in 2023, expanding at a CAGR of 25.10% from 2024 to 2032.
Non-conductive film for Semiconductor (HBM) refers to a protective layer or coating applied to semiconductor devices to enhance their resistance to electrostatic discharge (ESD) events, particularly Human Body Model (HBM) stresses.
Non-Conductive Film for Semiconductor (HBM) Market- Market Dynamics
Growing demand for semiconductor devices and the rising importance of ESD protection are expected to propel market demand
The growing adoption of semiconductor devices across different industries such as consumer electronics, automotive, telecommunications, and industrial applications is driving the demand for reliable ESD protection solutions. Continuous advancements in semiconductor manufacturing technologies, including finer geometry and more complex architectures, necessitate innovative ESD protection materials and techniques. Non-conductive films must keep pace with these technological advancements to remain effective.
Further, as semiconductor components become smaller and more sensitive to electrostatic discharge (ESD), the need for effective ESD protection solutions, including non-conductive films, intensifies. Failure to protect against ESD can lead to increased product failures and reliability issues. The trend towards miniaturization of electronic devices and increasing integration of functionalities into smaller form factors require ESD protection solutions that are compact, efficient, and capable of protecting densely packed semiconductor components.
Non-Conductive Film for Semiconductor (HBM) Market- Key Insights
As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 25.10% over the forecast period (2024-2032)
Based on Size segmentation, the 10- 25μm segment was predicted to show maximum market share in the year 2023, owing to high demand for small-sized electronic components.
Based on Type segmentation, the HBM2E segment was the leading Type in 2023, due to its high efficiency and greater reliability.
Based on Application segmentation, the consumer electronics segment was the leading Application in 2023, owing to increased demand for semiconductor films from wearables, smart devices, etc.
On the basis of region, Asia Pacific was the leading revenue generator in 2023, owing to the growing semiconductor industry across Taiwan, Vietnam, South Korea, etc.
The Global Non-Conductive Film for Semiconductor (HBM) Market is segmented on the basis of Size, Type, Application, and Region.
The market is divided into three categories based on Size: 10- 25μm, 25- 50μm, and others. The 10- 25μm segment dominates the market. High energy efficiency and suitable power capacity for smaller devices boost segment growth.
The market is divided into four categories based on Type: HBM2, HBM3, HBM2E, and HBM3E. The HBM2E segment dominates the market. Advancements in HBM and rising needs in semiconductor computing are contributing to market demand.
The market is divided into four categories based on Application: server, network, consumer electronics, and others. The consumer electronics segment dominates the market and is expected to maintain its high dominance during the forecast period. The Internet of Things (IoT), wearable devices, and smart electronics are expected to spur segmental growth.
Non-Conductive Film for Semiconductor (HBM) Market- Geographical Insights
Globally, this market is widespread in the regions of North America, Latin America, Europe, Asia Pacific, and the Middle East and Africa. In Asia Pacific, primarily China, Taiwan, South Korea, and Japan, dominate semiconductor manufacturing. This region is a major consumer of non-conductive films due to its extensive production of electronic devices. Rapid technological advancements in semiconductor manufacturing in countries like South Korea and Taiwan drive the demand for advanced ESD protection solutions. On the other side, in North America, leading semiconductor companies and research institutions in the United States drive innovation in semiconductor technology, including ESD protection solutions.
The Non-Conductive Film for Semiconductor (HBM) market is shaped by several key developments and strategies pursued by leading companies including mergers, collaboration, product development, etc. Companies such as 3M, Nitto Denko, and Toray Industries invest significantly in research and development to innovate new materials and technologies for ESD protection. Also, companies focus on offering customized solutions that address the specific needs of semiconductor manufacturers, such as tailored thicknesses, adhesion properties, and environmental resistances. Further, companies are expanding their geographic footprint to capture emerging markets and strengthen their presence in established regions.
In March 2024, Resonac Corporation announced a plan to expand their product materials in non-conductive film production.
In 2022, Sumitomo Chemical and UBE Industries collaborated to expand their presence in Europe and North America markets.