Press Fit Connector Market By Material (Stainless Steel, Brass), By Application (Automotive, Electronics, Data and Communication): Global Opportunity Analysis and Industry Forecast, 2023-2032

List of Tables

The press fit connector market was valued at $8.6 billion in 2022 and is estimated to reach $13.4 billion by 2032, exhibiting a CAGR of 4.8% from 2023 to 2032.

A press-fit connector is a connecting technique used in electronics that does not require soldering since it uses mechanical pressure to firmly link connections to printed circuit boards.

The necessity for dependable connections, trend toward miniaturization, requirement for high-speed data transmission, environmental concerns, and demand for rework ability are driving the expansion of the press-fit connector market. The widespread use of press-fit connectors in a variety of sectors and applications is because of all these components taken together.

In order to use this connection method, connector pins must be created with precise dimensions and shapes to fit into plated through-holes on the PCB. When the connector pins are forced into these holes during assembly, a gas-tight connection is created that improves signal integrity and guarantees reliable electrical performance. In cases where soldering may be difficult or unfeasible, such as high-frequency applications, miniature devices, and circumstances requiring immediate repairs or replacements, press-fit connections are used.

The growing need for production processes that are more automated and efficient are fueling the demand in the market. Automation has emerged as an important strategy as companies work to increase productivity and lower manufacturing costs. Press-fit connections, which work with automated assembly systems, are a natural fit for this trend. Press-fit connections, where the connectors are placed with exact force into pre-designed holes, are particularly suited for integration with robots and automated machines because of their precise nature.

Automated production lines are being used more often by manufacturers in a variety of industries, such as automotive, consumer electronics, and medical equipment, to increase throughput while preserving consistent quality. By providing quick, repeatable, and precise assembly without the complications of soldering, which can be more difficult to automate due to temperature control and solder joint quality problems, press-fit connections help with this shift.

For the purpose of analysis, the press-fit connector market scope covers segmentation based on material, application, and region. The report provides information on various materials including brass and stainless steel. Furthermore, the major applications covered in the study include automotive, electronic, and data and communication. In addition, it analyzes the current market trends across different regions such as North America (U.S., Canada, and Mexico), Europe (Germany, France, UK, and rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).

The key players operating in the press-fit connector market include TE Connectivity Ltd., Amphenol Corporation, Fujitsu Limited, HARTING Technology Group, Japan Aviation Electronics Industry, Ltd., J.S.T. Mfg. Co., Ltd., Radial, Samtec Inc., and Interplex Holdings Pte. Ltd.

Key Benefits For Stakeholders

This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the press fit connector market analysis from 2022 to 2032 to identify the prevailing press fit connector market opportunities.
The market research is offered along with information related to key drivers, restraints, and opportunities.
Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
In-depth analysis of the press fit connector market segmentation assists to determine the prevailing market opportunities.
Major countries in each region are mapped according to their revenue contribution to the global market.
Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
The report includes the analysis of the regional as well as global press fit connector market trends, key players, market segments, application areas, and market growth strategies.

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Product Benchmarking / Product specification and applications
Regulatory Guidelines
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Key Market Segments

By Material

Stainless Steel
Brass

By Application

Automotive
Electronics
Data and Communication

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- UK
- Germany
- France
- Rest of Europe
Asia-Pacific
- China
- Japan
- India
- South Korea
- Rest of Asia-Pacific
LAMEA
- Latin America
- Middle East
- Africa

Key Market Players:

TE Connectivity Ltd.
Amphenol Corporation
HARTING Technology Group
J.S.T. Mfg. Co., Ltd.
Radiall
Samtec Inc.
Interplex Holdings Pte. Ltd.
Fujitsu Limited
Japan Aviation Electronics Industry, Ltd.

Product Code: A136691

CHAPTER 1: INTRODUCTION

1.1. Report description
1.2. Key market segments
1.3. Key benefits to the stakeholders
1.4. Research methodology
- 1.4.1. Primary research
- 1.4.2. Secondary research
- 1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

2.1. CXO Perspective

CHAPTER 3: MARKET OVERVIEW

3.1. Market definition and scope
3.2. Key findings
- 3.2.1. Top impacting factors
- 3.2.2. Top investment pockets
3.3. Porter's five forces analysis
- 3.3.1. Moderate bargaining power of suppliers
- 3.3.2. Moderate to high threat of new entrants
- 3.3.3. Low threat of substitutes
- 3.3.4. Moderate to high intensity of rivalry
- 3.3.5. Moderate to high bargaining power of buyers
3.4. Market dynamics
- 3.4.1. Drivers
  - 3.4.1.1. Increase in adoption of electronics and infotainment systems in automotive sector
  - 3.4.1.2. Surge in demand for electronic systems and durable electricals is also growing
- 3.4.2. Restraints
  - 3.4.2.1. Less secured in high mechanical stress leading to intermittent connections or complete failure restricting market growth
- 3.4.3. Opportunities
  - 3.4.3.1. The adoption of high-speed data transfers solutions in aerospace and defense sector will create lucrative opportunities

CHAPTER 4: PRESS FIT CONNECTOR MARKET, BY MATERIAL

4.1. Overview
- 4.1.1. Market size and forecast
4.2. Stainless Steel
- 4.2.1. Key market trends, growth factors and opportunities
- 4.2.2. Market size and forecast, by region
- 4.2.3. Market share analysis by country
4.3. Brass
- 4.3.1. Key market trends, growth factors and opportunities
- 4.3.2. Market size and forecast, by region
- 4.3.3. Market share analysis by country

CHAPTER 5: PRESS FIT CONNECTOR MARKET, BY APPLICATION

5.1. Overview
- 5.1.1. Market size and forecast
5.2. Automotive
- 5.2.1. Key market trends, growth factors and opportunities
- 5.2.2. Market size and forecast, by region
- 5.2.3. Market share analysis by country
5.3. Electronics
- 5.3.1. Key market trends, growth factors and opportunities
- 5.3.2. Market size and forecast, by region
- 5.3.3. Market share analysis by country
5.4. Data and Communication
- 5.4.1. Key market trends, growth factors and opportunities
- 5.4.2. Market size and forecast, by region
- 5.4.3. Market share analysis by country

CHAPTER 6: PRESS FIT CONNECTOR MARKET, BY REGION

6.1. Overview
- 6.1.1. Market size and forecast By Region
6.2. North America
- 6.2.1. Key market trends, growth factors and opportunities
- 6.2.2. Market size and forecast, by Material
- 6.2.3. Market size and forecast, by Application
- 6.2.4. Market size and forecast, by country
  - 6.2.4.1. U.S.
  - 6.2.4.1.1. Market size and forecast, by Material
  - 6.2.4.1.2. Market size and forecast, by Application
  - 6.2.4.2. Canada
  - 6.2.4.2.1. Market size and forecast, by Material
  - 6.2.4.2.2. Market size and forecast, by Application
  - 6.2.4.3. Mexico
  - 6.2.4.3.1. Market size and forecast, by Material
  - 6.2.4.3.2. Market size and forecast, by Application
6.3. Europe
- 6.3.1. Key market trends, growth factors and opportunities
- 6.3.2. Market size and forecast, by Material
- 6.3.3. Market size and forecast, by Application
- 6.3.4. Market size and forecast, by country
  - 6.3.4.1. UK
  - 6.3.4.1.1. Market size and forecast, by Material
  - 6.3.4.1.2. Market size and forecast, by Application
  - 6.3.4.2. Germany
  - 6.3.4.2.1. Market size and forecast, by Material
  - 6.3.4.2.2. Market size and forecast, by Application
  - 6.3.4.3. France
  - 6.3.4.3.1. Market size and forecast, by Material
  - 6.3.4.3.2. Market size and forecast, by Application
  - 6.3.4.4. Rest of Europe
  - 6.3.4.4.1. Market size and forecast, by Material
  - 6.3.4.4.2. Market size and forecast, by Application
6.4. Asia-Pacific
- 6.4.1. Key market trends, growth factors and opportunities
- 6.4.2. Market size and forecast, by Material
- 6.4.3. Market size and forecast, by Application
- 6.4.4. Market size and forecast, by country
  - 6.4.4.1. China
  - 6.4.4.1.1. Market size and forecast, by Material
  - 6.4.4.1.2. Market size and forecast, by Application
  - 6.4.4.2. Japan
  - 6.4.4.2.1. Market size and forecast, by Material
  - 6.4.4.2.2. Market size and forecast, by Application
  - 6.4.4.3. India
  - 6.4.4.3.1. Market size and forecast, by Material
  - 6.4.4.3.2. Market size and forecast, by Application
  - 6.4.4.4. South Korea
  - 6.4.4.4.1. Market size and forecast, by Material
  - 6.4.4.4.2. Market size and forecast, by Application
  - 6.4.4.5. Rest of Asia-Pacific
  - 6.4.4.5.1. Market size and forecast, by Material
  - 6.4.4.5.2. Market size and forecast, by Application
6.5. LAMEA
- 6.5.1. Key market trends, growth factors and opportunities
- 6.5.2. Market size and forecast, by Material
- 6.5.3. Market size and forecast, by Application
- 6.5.4. Market size and forecast, by country
  - 6.5.4.1. Latin America
  - 6.5.4.1.1. Market size and forecast, by Material
  - 6.5.4.1.2. Market size and forecast, by Application
  - 6.5.4.2. Middle East
  - 6.5.4.2.1. Market size and forecast, by Material
  - 6.5.4.2.2. Market size and forecast, by Application
  - 6.5.4.3. Africa
  - 6.5.4.3.1. Market size and forecast, by Material
  - 6.5.4.3.2. Market size and forecast, by Application

CHAPTER 7: COMPETITIVE LANDSCAPE

7.1. Introduction
7.2. Top winning strategies
7.3. Product mapping of top 10 player
7.4. Competitive dashboard
7.5. Competitive heatmap
7.6. Top player positioning, 2022

CHAPTER 8: COMPANY PROFILES

8.1. TE Connectivity Ltd.
- 8.1.1. Company overview
- 8.1.2. Key executives
- 8.1.3. Company snapshot
- 8.1.4. Operating business segments
- 8.1.5. Product portfolio
- 8.1.6. Business performance
8.2. Amphenol Corporation
- 8.2.1. Company overview
- 8.2.2. Key executives
- 8.2.3. Company snapshot
- 8.2.4. Operating business segments
- 8.2.5. Product portfolio
- 8.2.6. Business performance
8.3. Fujitsu Limited
- 8.3.1. Company overview
- 8.3.2. Key executives
- 8.3.3. Company snapshot
- 8.3.4. Operating business segments
- 8.3.5. Product portfolio
- 8.3.6. Business performance
8.4. Radiall
- 8.4.1. Company overview
- 8.4.2. Key executives
- 8.4.3. Company snapshot
- 8.4.4. Operating business segments
- 8.4.5. Product portfolio
8.5. HARTING Technology Group
- 8.5.1. Company overview
- 8.5.2. Key executives
- 8.5.3. Company snapshot
- 8.5.4. Operating business segments
- 8.5.5. Product portfolio
- 8.5.6. Key strategic moves and developments
8.6. Japan Aviation Electronics Industry, Ltd.
- 8.6.1. Company overview
- 8.6.2. Key executives
- 8.6.3. Company snapshot
- 8.6.4. Operating business segments
- 8.6.5. Product portfolio
- 8.6.6. Business performance
8.7. J.S.T. Mfg. Co., Ltd.
- 8.7.1. Company overview
- 8.7.2. Key executives
- 8.7.3. Company snapshot
- 8.7.4. Operating business segments
- 8.7.5. Product portfolio
- 8.7.6. Key strategic moves and developments
8.8. Interplex Holdings Pte. Ltd.
- 8.8.1. Company overview
- 8.8.2. Key executives
- 8.8.3. Company snapshot
- 8.8.4. Operating business segments
- 8.8.5. Product portfolio
- 8.8.6. Key strategic moves and developments
8.9. Samtec Inc.
- 8.9.1. Company overview
- 8.9.2. Key executives
- 8.9.3. Company snapshot
- 8.9.4. Operating business segments
- 8.9.5. Product portfolio