PUBLISHER: Allied Market Research | PRODUCT CODE: 1298233
PUBLISHER: Allied Market Research | PRODUCT CODE: 1298233
The global die attach machine market was valued at $1,185.7 million in 2021 and is projected to reach $2,103.6 million by 2031, registering a CAGR of 5.9% from 2022 to 2031. Die attach machine is used for the attachment of semiconductor device die and its package. Additionally, it is a backend process of chip manufacturing and also a key component of the semiconductor supply chain.
Rise in demand for electronic products such as robotics, automotive electronics, tablets, smartphones, electrical household appliances, automation systems, electronic medical equipment, and others are driving the growth of die attach machine market. Moreover, the increase in government support for semiconductor industry is a major driver of the die attach machine market growth. However, the fluctuation in raw material prices hinders die attach machine market growth.
Furthermore, due to COVID-19, a global semiconductor shortage was witnessed during 2020 and 2021; thus, the die attach machine market witnessed a halt, which led to a small term decline in the market. Contrarily, the semiconductor shortage made countries realize that dependence on other countries for semiconductors is detrimental for their growth. Thus, various countries are investing to strengthen their domestic semiconductor industry. However, as the number of COVID-19 cases has reduced to a significant level, the market is expected to fully recover by the end of 2023.
Furthermore, growth in usage of LED circuits offers lucrative growth opportunities for the market player during the forecast period.
The global die attach machine market is segmented on the basis of type, technique, application, and region. By type, the market is categorized into flip chip bonder and die bonder. Depending on technique, it is fragmented into epoxy, soft solder, sintering, eutectic, and others. Depending on application, it is fragmented into RF and MEMS, optoelectronics, logic, memory, CMOS image sensors, LED, and others. By region, it is analyzed across North America (U.S., Canada, and Mexico), Europe (Germany, France, Italy, UK, and rest of Europe), Asia-Pacific (China, India, Japan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).
Key companies profiled in the die attach machine market report include: ASM Pacific Technology Limited, BE Semiconductor Industries N.V, Dr. Tresky AG, Fasford Technology Co. Limited, Inseto UK Limited, Kulicke And Soffa Industries, microassembly technologies limited, Palomar Technologies, Shinkawa Limited, Panasonic Industry Co., Ltd.