Thin Wafer Processing and Dicing Equipment Market By Equipment Type, By Wafer Size, By Application : Global Opportunity Analysis and Industry Forecast, 2021-2031

List of Tables

The global thin wafer processing and dicing equipment market was valued at $643.78 million in 2021, and is projected to reach $1,196.49 million by 2031, registering a CAGR of 6.67% from 2022 to 2031.

A wafer is a thin slice of semiconductor material and dicing is the process which is used to cut or groove semiconductors, glass crystal and many other types of materials. Instrument used during this process is known as dicing equipment. Wafer dicing is the process of separating the dies from a semiconductor wafer after the wafer has been processed. The need for miniaturization towards small, powerful, and inexpensive device configurations has created the need for thin wafers. Most of these have reached 100 µm or even less than 50 µm for applications such as memory and power devices. Wafers below 390 µm are considered thin wafers. These thin wafers are expected to be in high demand for applications in Radio Frequency Identification (RFID), Micro Electro Mechanical Systems (MEMS), and power devices.

The thin wafer processing and dicing equipment market is segmented on the basis of equipment type, application, wafer size, and region. On the basis of equipment type, the market is divided into thinning equipment and dicing equipment. On the basis of application, it is divided into memory and logic Through Silicon Via (TSV), Micro Electro Mechanical Systems (MEMS) devices, power devices, CMOS image sensors, and Radio Frequency Identification (RFID). On the basis of wafer size, the market is divided into less than 4-inch, 5-inch and 6-inch, 8-inch, and 12-inch. Region-wise, thin wafer processing and dicing equipment market trends are analyzed across North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and rest of Asia-Pacific) and LAMEA (Latin America, the Middle East, and Africa).

The key thin wafer processing and dicing equipment market leaders profiled in the report include Suzhou Delphi Laser Co. Ltd., Synova, UTAC Holding, Ltd., Plasma-Therm, Disco Corporation, Neon Tech Co. Ltd., Panasonic System Solutions, EV Group (EVG), Lam Research Corporation, SPTS Technologies Ltd. These key players adopt several strategies such as new product launch and development, acquisition, partnership and collaboration and business expansion to increase the thin wafer processing and dicing equipment market share during the forecast period.

Key Benefits For Stakeholders

This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the thin wafer processing and dicing equipment market analysis from 2021 to 2031 to identify the prevailing thin wafer processing and dicing equipment market opportunities.
The market research is offered along with information related to key drivers, restraints, and opportunities.
Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders to make profit-oriented business decisions and strengthen their supplier-buyer network.
In-depth analysis of the thin wafer processing and dicing equipment market segmentation assists to determine the prevailing market opportunities.
Major countries in each region are mapped according to their revenue contribution to the global market.
Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
The report includes an analysis of the regional as well as global thin wafer processing and dicing equipment market trends, key players, market segments, application areas, and market growth strategies.

Key Market Segments

By Wafer Size

Less than 4 inch
5 inch and 6 inch
8 inch
12 inch

By Equipment Type

Thinning Equipment
Dicing Equipment

By Application

Memory and Logic
MEMS Devices
CMOS Image Sensors
Power Devices
RFID

By Region

North America
- U.S.
- Canada
- Mexico
Europe
- UK
- Germany
- France
- Rest of Europe
Asia-Pacific
- China
- Japan
- India
- South Korea
- Rest of Asia-Pacific
LAMEA
- Latin America
- Middle East
- Africa

Key Market Players

Synova SA
Plasma-Therm
Disco Corporation
Panasonic
EV Group (EVG)
SPTS Technologies Ltd.
UTAC Holding, Ltd
Neon Tech Co. Ltd.
Lam Research Corp.
Suzhou Delphi Laser Co., Ltd.

Product Code: A14701

CHAPTER 1:INTRODUCTION

1.1.Report description
1.2.Key market segments
1.3.Key benefits to the stakeholders
1.4.Research Methodology
- 1.4.1.Secondary research
- 1.4.2.Primary research
- 1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

2.1.Key findings of the study
2.2.CXO Perspective

CHAPTER 3:MARKET OVERVIEW

3.1.Market definition and scope
3.2.Key findings
- 3.2.1.Top investment pockets
3.3.Porter's five forces analysis
3.4.Market dynamics
- 3.4.1.Drivers
  - 3.4.1.1. Growing demand for high-performance integrated circuits and developments in semiconductor technology
  - 3.4.1.2. Increasing adoption of Radio Frequency Identification (RFID) tags
- 3.4.2.Restraints
  - 3.4.2.1. High expenses associated with fabrication, maintenance, and manufacturing processes
- 3.4.3.Opportunities
  - 3.4.3.1. Investment in wafer enhancement could provide profitable opportunities
3.5.COVID-19 Impact Analysis on the market

CHAPTER 4: THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY EQUIPMENT TYPE

4.1 Overview
- 4.1.1 Market size and forecast
4.2. Thinning Equipment
- 4.2.1 Key market trends, growth factors and opportunities
- 4.2.2 Market size and forecast, by region
- 4.2.3 Market share analysis by country
4.3. Dicing Equipment
- 4.3.1 Key market trends, growth factors and opportunities
- 4.3.2 Market size and forecast, by region
- 4.3.3 Market share analysis by country

CHAPTER 5: THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY WAFER SIZE

5.1 Overview
- 5.1.1 Market size and forecast
5.2. Less than 4 inch
- 5.2.1 Key market trends, growth factors and opportunities
- 5.2.2 Market size and forecast, by region
- 5.2.3 Market share analysis by country
5.3. 5 inch and 6 inch
- 5.3.1 Key market trends, growth factors and opportunities
- 5.3.2 Market size and forecast, by region
- 5.3.3 Market share analysis by country
5.4. 8 inch
- 5.4.1 Key market trends, growth factors and opportunities
- 5.4.2 Market size and forecast, by region
- 5.4.3 Market share analysis by country
5.5. 12 inch
- 5.5.1 Key market trends, growth factors and opportunities
- 5.5.2 Market size and forecast, by region
- 5.5.3 Market share analysis by country

CHAPTER 6: THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY APPLICATION

6.1 Overview
- 6.1.1 Market size and forecast
6.2. Memory and Logic
- 6.2.1 Key market trends, growth factors and opportunities
- 6.2.2 Market size and forecast, by region
- 6.2.3 Market share analysis by country
6.3. MEMS Devices
- 6.3.1 Key market trends, growth factors and opportunities
- 6.3.2 Market size and forecast, by region
- 6.3.3 Market share analysis by country
6.4. CMOS Image Sensors
- 6.4.1 Key market trends, growth factors and opportunities
- 6.4.2 Market size and forecast, by region
- 6.4.3 Market share analysis by country
6.5. Power Devices
- 6.5.1 Key market trends, growth factors and opportunities
- 6.5.2 Market size and forecast, by region
- 6.5.3 Market share analysis by country
6.6. RFID
- 6.6.1 Key market trends, growth factors and opportunities
- 6.6.2 Market size and forecast, by region
- 6.6.3 Market share analysis by country

CHAPTER 7: THIN WAFER PROCESSING AND DICING EQUIPMENT MARKET, BY REGION

7.1 Overview
- 7.1.1 Market size and forecast
7.2 North America
- 7.2.1 Key trends and opportunities
- 7.2.2 North America Market size and forecast, by Equipment Type
- 7.2.3 North America Market size and forecast, by Wafer Size
- 7.2.4 North America Market size and forecast, by Application
- 7.2.5 North America Market size and forecast, by country
  - 7.2.5.1 U.S.
  - 7.2.5.1.1 Key market trends, growth factors and opportunities
  - 7.2.5.1.2 Market size and forecast, by Equipment Type
  - 7.2.5.1.3 Market size and forecast, by Wafer Size
  - 7.2.5.1.4 Market size and forecast, by Application
  - 7.2.5.2 Canada
  - 7.2.5.2.1 Key market trends, growth factors and opportunities
  - 7.2.5.2.2 Market size and forecast, by Equipment Type
  - 7.2.5.2.3 Market size and forecast, by Wafer Size
  - 7.2.5.2.4 Market size and forecast, by Application
  - 7.2.5.3 Mexico
  - 7.2.5.3.1 Key market trends, growth factors and opportunities
  - 7.2.5.3.2 Market size and forecast, by Equipment Type
  - 7.2.5.3.3 Market size and forecast, by Wafer Size
  - 7.2.5.3.4 Market size and forecast, by Application
7.3 Europe
- 7.3.1 Key trends and opportunities
- 7.3.2 Europe Market size and forecast, by Equipment Type
- 7.3.3 Europe Market size and forecast, by Wafer Size
- 7.3.4 Europe Market size and forecast, by Application
- 7.3.5 Europe Market size and forecast, by country
  - 7.3.5.1 UK
  - 7.3.5.1.1 Key market trends, growth factors and opportunities
  - 7.3.5.1.2 Market size and forecast, by Equipment Type
  - 7.3.5.1.3 Market size and forecast, by Wafer Size
  - 7.3.5.1.4 Market size and forecast, by Application
  - 7.3.5.2 Germany
  - 7.3.5.2.1 Key market trends, growth factors and opportunities
  - 7.3.5.2.2 Market size and forecast, by Equipment Type
  - 7.3.5.2.3 Market size and forecast, by Wafer Size
  - 7.3.5.2.4 Market size and forecast, by Application
  - 7.3.5.3 France
  - 7.3.5.3.1 Key market trends, growth factors and opportunities
  - 7.3.5.3.2 Market size and forecast, by Equipment Type
  - 7.3.5.3.3 Market size and forecast, by Wafer Size
  - 7.3.5.3.4 Market size and forecast, by Application
  - 7.3.5.4 Rest of Europe
  - 7.3.5.4.1 Key market trends, growth factors and opportunities
  - 7.3.5.4.2 Market size and forecast, by Equipment Type
  - 7.3.5.4.3 Market size and forecast, by Wafer Size
  - 7.3.5.4.4 Market size and forecast, by Application
7.4 Asia-Pacific
- 7.4.1 Key trends and opportunities
- 7.4.2 Asia-Pacific Market size and forecast, by Equipment Type
- 7.4.3 Asia-Pacific Market size and forecast, by Wafer Size
- 7.4.4 Asia-Pacific Market size and forecast, by Application
- 7.4.5 Asia-Pacific Market size and forecast, by country
  - 7.4.5.1 China
  - 7.4.5.1.1 Key market trends, growth factors and opportunities
  - 7.4.5.1.2 Market size and forecast, by Equipment Type
  - 7.4.5.1.3 Market size and forecast, by Wafer Size
  - 7.4.5.1.4 Market size and forecast, by Application
  - 7.4.5.2 Japan
  - 7.4.5.2.1 Key market trends, growth factors and opportunities
  - 7.4.5.2.2 Market size and forecast, by Equipment Type
  - 7.4.5.2.3 Market size and forecast, by Wafer Size
  - 7.4.5.2.4 Market size and forecast, by Application
  - 7.4.5.3 India
  - 7.4.5.3.1 Key market trends, growth factors and opportunities
  - 7.4.5.3.2 Market size and forecast, by Equipment Type
  - 7.4.5.3.3 Market size and forecast, by Wafer Size
  - 7.4.5.3.4 Market size and forecast, by Application
  - 7.4.5.4 South Korea
  - 7.4.5.4.1 Key market trends, growth factors and opportunities
  - 7.4.5.4.2 Market size and forecast, by Equipment Type
  - 7.4.5.4.3 Market size and forecast, by Wafer Size
  - 7.4.5.4.4 Market size and forecast, by Application
  - 7.4.5.5 Rest of Asia-Pacific
  - 7.4.5.5.1 Key market trends, growth factors and opportunities
  - 7.4.5.5.2 Market size and forecast, by Equipment Type
  - 7.4.5.5.3 Market size and forecast, by Wafer Size
  - 7.4.5.5.4 Market size and forecast, by Application
7.5 LAMEA
- 7.5.1 Key trends and opportunities
- 7.5.2 LAMEA Market size and forecast, by Equipment Type
- 7.5.3 LAMEA Market size and forecast, by Wafer Size
- 7.5.4 LAMEA Market size and forecast, by Application
- 7.5.5 LAMEA Market size and forecast, by country
  - 7.5.5.1 Latin America
  - 7.5.5.1.1 Key market trends, growth factors and opportunities
  - 7.5.5.1.2 Market size and forecast, by Equipment Type
  - 7.5.5.1.3 Market size and forecast, by Wafer Size
  - 7.5.5.1.4 Market size and forecast, by Application
  - 7.5.5.2 Middle East
  - 7.5.5.2.1 Key market trends, growth factors and opportunities
  - 7.5.5.2.2 Market size and forecast, by Equipment Type
  - 7.5.5.2.3 Market size and forecast, by Wafer Size
  - 7.5.5.2.4 Market size and forecast, by Application
  - 7.5.5.3 Africa
  - 7.5.5.3.1 Key market trends, growth factors and opportunities
  - 7.5.5.3.2 Market size and forecast, by Equipment Type
  - 7.5.5.3.3 Market size and forecast, by Wafer Size
  - 7.5.5.3.4 Market size and forecast, by Application

CHAPTER 8: COMPETITIVE LANDSCAPE

8.1. Introduction
8.2. Top winning strategies
8.3. Product Mapping of Top 10 Player
8.4. Competitive Dashboard
8.5. Competitive Heatmap
8.6. Top player positioning, 2021

CHAPTER 9: COMPANY PROFILES

9.1 Synova SA
- 9.1.1 Company overview
- 9.1.2 Key Executives
- 9.1.3 Company snapshot
- 9.1.4 Operating business segments
- 9.1.5 Product portfolio
- 9.1.6 Business performance
- 9.1.7 Key strategic moves and developments
9.2 Plasma-Therm
- 9.2.1 Company overview
- 9.2.2 Key Executives
- 9.2.3 Company snapshot
- 9.2.4 Operating business segments
- 9.2.5 Product portfolio
- 9.2.6 Business performance
- 9.2.7 Key strategic moves and developments
9.3 Disco Corporation
- 9.3.1 Company overview
- 9.3.2 Key Executives
- 9.3.3 Company snapshot
- 9.3.4 Operating business segments
- 9.3.5 Product portfolio
- 9.3.6 Business performance
- 9.3.7 Key strategic moves and developments
9.4 Panasonic
- 9.4.1 Company overview
- 9.4.2 Key Executives
- 9.4.3 Company snapshot
- 9.4.4 Operating business segments
- 9.4.5 Product portfolio
- 9.4.6 Business performance
- 9.4.7 Key strategic moves and developments
9.5 EV Group (EVG)
- 9.5.1 Company overview
- 9.5.2 Key Executives
- 9.5.3 Company snapshot
- 9.5.4 Operating business segments
- 9.5.5 Product portfolio
- 9.5.6 Business performance
- 9.5.7 Key strategic moves and developments
9.6 SPTS Technologies Ltd.
- 9.6.1 Company overview
- 9.6.2 Key Executives
- 9.6.3 Company snapshot
- 9.6.4 Operating business segments
- 9.6.5 Product portfolio
- 9.6.6 Business performance
- 9.6.7 Key strategic moves and developments
9.7 UTAC Holding, Ltd
- 9.7.1 Company overview
- 9.7.2 Key Executives
- 9.7.3 Company snapshot
- 9.7.4 Operating business segments
- 9.7.5 Product portfolio
- 9.7.6 Business performance
- 9.7.7 Key strategic moves and developments
9.8 Neon Tech Co. Ltd.
- 9.8.1 Company overview
- 9.8.2 Key Executives
- 9.8.3 Company snapshot
- 9.8.4 Operating business segments
- 9.8.5 Product portfolio
- 9.8.6 Business performance
- 9.8.7 Key strategic moves and developments
9.9 Lam Research Corp.
- 9.9.1 Company overview
- 9.9.2 Key Executives
- 9.9.3 Company snapshot
- 9.9.4 Operating business segments
- 9.9.5 Product portfolio
- 9.9.6 Business performance
- 9.9.7 Key strategic moves and developments
9.10 Suzhou Delphi Laser Co., Ltd.
- 9.10.1 Company overview
- 9.10.2 Key Executives
- 9.10.3 Company snapshot
- 9.10.4 Operating business segments
- 9.10.5 Product portfolio
- 9.10.6 Business performance
- 9.10.7 Key strategic moves and developments