DRAMeXchange Market Intelligence Service - HBM Package

HBM Package Service covers as below:

HBM Market Bulletin (Publish time: At the beginning of the month)

This includes the insights into the HBM market, covering significant developments and trends with detailed reviews of key players.

HBM Research Report (Publish time: At the end of Feb, May, August and Nov.)

The comprehensive quarterly reports detailing market trends, supplier comparisons, and forecast data. It provides the critical analysis on HBM production overview, Spec. outlook, and shipment forecast, etc.

HBM Datasheet (Publish time: At the beginning of Jan., April, July, Oct.)

With our expertise in the memory market, this provides a comprehensive analysis and forecast on HBM market share, ASP, wafer capacity, demand consumption, etc.

The content of it is as follows:

• (1) HBM Spec. Outlook
• (2) Market Share by HBM Chip Out
• (3) Breakdown by HBM Generation
• (4) Breakdown by HBM Layers
• (5) HBM Wafer Capacity
• (6) HBM Revenue by Product
• (7) HBM Consumption by AI chips
• (8) Supply and HBM Consumption
• (9) HBM ASP per Gb
• (10) Revenue Market Share
• (11) HBM Revenue by Suppliers

Special Report

First-hand information for un-expecting issue and our point of view on the market news update.

Price Update

Aperiodically update the latest pricing information.

Analyst Consulting Service

Members could schedule quarterly conference call with Semiconductor Research Analysts.